Inventor · disambiguated record
Kaori Akamatsu
Also filed as: AKAMATSU KAORI
26 granted patents·12 pending applications·279 citations·filing 1997–2025
96Inventor score
Files withNITTO DENKO CORP17MATSUSHITA ELECTRIC INDUSTRIAL CO LTD10PANASONIC CORP4JOLED INC3AKAMATSU KAORI2
Top patents by PatentIndex Score
38 records- 0193US7205615B2Semiconductor device having internal stress filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 17, 2007·53 cites·12 claims
- 0292US11964462B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2023·Granted Apr 23, 2024·1 cites·1 claims
- 0392US7417289B2Semiconductor device having internal stress filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Granted Aug 26, 2008·16 cites·29 claims
- 0488US2024400866A1Electrically peelable adhesive composition, adhesive sheet, and joined bodyNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 0587US9153791B2Organic EL display panelAKAMATSU KAORI·Filed 2011·Granted Oct 6, 2015·9 cites·5 claims
- 0687US6380585B1Nonvolatile semiconductor device capable of increased electron injection efficiencyMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Apr 30, 2002·37 cites·7 claims
- 0785US6051860ANonvolatile semiconductor memory device and method for fabricating the same and semiconductor integrated circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Apr 18, 2000·50 cites·7 claims
- 0881US11279855B2Electrically peelable adhesive composition, adhesive sheet, and joined bodyNITTO DENKO CORP·Filed 2016·Granted Mar 22, 2022·1 cites·15 claims
- 0980US12441083B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2024·Granted Oct 14, 2025·0 cites·2 claims
- 1079US6358799B2Nonvolatile semiconductor memory device and method for fabricating the same, and semiconductor integrated circuit deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Mar 19, 2002·20 cites·13 claims
- 1178US2022177734A1Electrically peelable adhesive composition, adhesive sheet, and joined bodyNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1277US11623429B2Electrical debonding adhesive sheet, joined body, and joining and separation method for adherendNITTO DENKO CORP·Filed 2019·Granted Apr 11, 2023·0 cites·2 claims
- 1376US6312981B1Method for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 6, 2001·19 cites·34 claims
- 1472US8816363B2Method of manufacturing an organic light-emitting element, organic light-emitting element, display panel, and display deviceISOBE TAKASHI·Filed 2012·Granted Aug 26, 2014·2 cites·2 claims
- 1571US2019031929A1Electrically peelable adhesive composition, adhesive sheet, and joined bodyNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 1668US12104100B2Adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2019·Granted Oct 1, 2024·0 cites·20 claims
- 1766US2020002581A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 1865US8203186B2Semiconductor device including a stress filmTSUTSUI MASAFUMI·Filed 2011·Granted Jun 19, 2012·1 cites·18 claims
- 1965US2025145870A1Electrically debondable adhesive composition, adhesive sheet, and adhered bodyNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 2064US6184553B1Nonvolatile semiconductor memory device and method for fabricating the same, and semiconductor integrated circuit deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 6, 2001·18 cites·21 claims
- 2164US6147379ASemiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 14, 2000·23 cites·18 claims
- 2262US7893501B2Semiconductor device including MISFET having internal stress filmPANASONIC CORP·Filed 2008·Granted Feb 22, 2011·1 cites·25 claims
- 2360US10756308B2Organic electroluminescence element and method of manufacturing the sameJOLED INC·Filed 2018·Granted Aug 25, 2020·0 cites·6 claims
- 2459US6121655ANonvolatile semiconductor memory device and method for fabricating the same and semiconductor integrated circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Sep 19, 2000·16 cites·11 claims
- 2558US12037522B2Electrical debonding type adhesive sheet, joined body, and debonding method for joined bodyNITTO DENKO CORP·Filed 2019·Granted Jul 16, 2024·0 cites·10 claims
- 2658US9184406B2Method of manufacturing an organic light-emitting element, organic light-emitting element, display panel, and display deviceJOLED INC·Filed 2014·Granted Nov 10, 2015·0 cites·20 claims
- 2755US2023167339A1Adhesive composition, adhesive sheet, and joined bodyNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 2854US8383486B2Method of manufacturing a semiconductor device including a stress filmPANASONIC CORP·Filed 2012·Granted Feb 26, 2013·0 cites·2 claims
- 2954US2023159799A1Adhesive composition, adhesive sheet, and joined bodyNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 3054US2022112410A1Separation and bonding method for adherendNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 3153US6251718B1Method for manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 26, 2001·12 cites·20 claims
- 3252US2010171415A1Light-emitting device and display apparatusPANASONIC CORP·Filed 2009·Application pending·0 cites
- 3348US10008698B2Organic electroluminescence element and method of manufacturing the sameJOLED INC·Filed 2015·Granted Jun 26, 2018·0 cites·8 claims
- 3447US2015155516A1Organic light-emitting element and production method thereforPANASONIC CORP·Filed 2013·Application pending·0 cites
- 3545US11236256B2Double-sided adhesive sheet, joined body comprising double-sided adhesive sheet, and method for joining/separating adherendsNITTO DENKO CORP·Filed 2016·Granted Feb 1, 2022·0 cites·10 claims
- 3645US9159771B2Organic EL panel and manufacturing method thereofAKAMATSU KAORI·Filed 2011·Granted Oct 13, 2015·0 cites·12 claims
- 3741US2022032600A1Separation method and bonding method for adherendNITTO DENKO CORP·Filed 2019·Application pending·0 cites
- 3838US2022282125A1Electrical debonding type adhesive sheet, joined body, and method for separating joined bodyNITTO DENKO CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →