Inventor · disambiguated record
Kai Bai
Also filed as: BAI KAI · BAI KAI-YI
2 granted patents·1 citations·filing 2021–2022
30Inventor score
Files withCORETECH SYS CO LTD1XINHUA HOSPITAL AFFILIATED TO SHANGHAI JIAOTONG UNIV SCHOOL OF MEDICINE1
Top patents by PatentIndex Score
2 records- 0180US11521903B1Method of measuring voids in underfill packageCORETECH SYS CO LTD·Filed 2021·Granted Dec 6, 2022·1 cites·12 claims
- 0251US11986575B2Preparation method of absorbable vascular stent coating for angiostenosis in infantXINHUA HOSPITAL AFFILIATED TO SHANGHAI JIAOTONG UNIV SCHOOL OF MEDICINE·Filed 2022·Granted May 21, 2024·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →