Inventor · disambiguated record
Karl E. Boggs
Also filed as: BOGGS KARL · BOGGS KARL E · WRSCHKA PETER
21 granted patents·12 pending applications·354 citations·filing 1998–2016
96Inventor score
Top patents by PatentIndex Score
33 records- 0195US7361603B2Passivative chemical mechanical polishing composition for copper film planarizationADVANCED TECH MATERIALS·Filed 2005·Granted Apr 22, 2008·25 cites·40 claims
- 0293US9074170B2Copper cleaning and protection formulationsBARNES JEFFREY A·Filed 2009·Granted Jul 7, 2015·26 cites·22 claims
- 0392US7300601B2Passivative chemical mechanical polishing composition for copper film planarizationADVANCED TECH MATERIALS·Filed 2002·Granted Nov 27, 2007·45 cites·79 claims
- 0490US8685909B2Antioxidants for post-CMP cleaning formulationsANGST DAVID·Filed 2009·Granted Apr 1, 2014·22 cites·19 claims
- 0590US8618036B2Aqueous cerium-containing solution having an extended bath lifetime for removing mask materialAFZALI-ARDAKANI ALI·Filed 2011·Granted Dec 31, 2013·11 cites·23 claims
- 0690US8304344B2High throughput chemical mechanical polishing composition for metal film planarizationBOGGS KARL E·Filed 2008·Granted Nov 6, 2012·26 cites·18 claims
- 0790US8236695B2Method of passivating chemical mechanical polishing compositions for copper film planarization processesLIU JUN·Filed 2008·Granted Aug 7, 2012·11 cites·20 claims
- 0889US9074169B2Lithographic tool in situ clean formulationsCHEN TIANNIU·Filed 2010·Granted Jul 7, 2015·10 cites·16 claims
- 0984US9528078B2Antioxidants for post-CMP cleaning formulationsADVANCED TECH MATERIALS·Filed 2014·Granted Dec 27, 2016·4 cites·20 claims
- 1084US7736405B2Chemical mechanical polishing compositions for copper and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2003·Granted Jun 15, 2010·28 cites·40 claims
- 1183USRE46427EAntioxidants for post-CMP cleaning formulationsADVANCED TECH MATERIALS·Filed 2015·Granted Jun 6, 2017·2 cites·19 claims
- 1279US8539781B2Component for solar adsorption refrigeration system and method of making such componentCARRUTHERS J DONALD·Filed 2008·Granted Sep 24, 2013·4 cites·17 claims
- 1377US6325696B1Piezo-actuated CMP carrierIBM·Filed 1999·Granted Dec 4, 2001·50 cites·14 claims
- 1473US9522773B2Substantially rigid collapsible liner and flexible gusseted or non-gusseted liners and methods of manufacturing the same and methods for limiting choke-off in linersTOM GLENN·Filed 2010·Granted Dec 20, 2016·4 cites·26 claims
- 1565US6087191AMethod for repairing surface defectsIBM·Filed 1998·Granted Jul 11, 2000·28 cites·21 claims
- 1664US2017096624A1New antioxidants for post-cmp cleaning formulationsADVANCED TECH MATERIALS·Filed 2016·Application pending·0 cites
- 1758US9132412B2Component for solar adsorption refrigeration system and method of making such componentENTEGRIS INC·Filed 2013·Granted Sep 15, 2015·0 cites·20 claims
- 1855US5972787ACMP process using indicator areas to determine endpointIBM·Filed 1998·Granted Oct 26, 1999·20 cites·7 claims
- 1955US2007181852A1Passivative chemical mechanical polishing composition for copper film planarizationLIU JUN·Filed 2007·Application pending·0 cites
- 2055US2014034671A1Generally cylindrically-shaped liner for use in pressure dispense systems and methods of manufacturing the sameCHISM RICHARD·Filed 2011·Application pending·0 cites
- 2153US2016159519A1Generally cylindrically-shaped liner for use in pressure dispense systems and methods of manufacturing the sameADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
- 2251US6102776AApparatus and method for controlling polishing of integrated circuit substratesIBM·Filed 1999·Granted Aug 15, 2000·15 cites·17 claims
- 2346US6296717B1Regeneration of chemical mechanical polishing pads in-situIBM·Filed 1999·Granted Oct 2, 2001·12 cites·14 claims
- 2445US6857434B2CMP slurry additive for foreign matter detectionIBM·Filed 2002·Granted Feb 22, 2005·2 cites·8 claims
- 2545US2010248480A1Chemical mechanical polishing compositions for copper and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2010·Application pending·0 cites
- 2645US2010087065A1Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applicationsADVANCED TECH MATERIALS·Filed 2008·Application pending·0 cites
- 2745US2009253072A1Nanoparticle reversible contrast enhancement material and methodPETRUSKA MELISSA A·Filed 2009·Application pending·0 cites
- 2845US2016032221A1Copper cleaning and protection formulationsADVANCED TECH MATERIALS·Filed 2015·Application pending·0 cites
- 2941US6106374AAcoustically agitated deliveryIBM·Filed 1998·Granted Aug 22, 2000·9 cites·24 claims
- 3041US2015162213A1Formulations for wet etching nipt during silicide fabricationADVANCED TECH MATERIALS·Filed 2013·Application pending·0 cites
- 3141US2009215269A1Integrated chemical mechanical polishing composition and process for single platen processingADVANCED TECH MATERIALS·Filed 2006·Application pending·0 cites
- 3239US2006249482A1Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using sameWRSCHKA PETER·Filed 2004·Application pending·0 cites
- 3338US2015114429A1Aqueous clean solution with low copper etch rate for organic residue removal improvementJENQ SHRANE NING·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →