Inventor · disambiguated record
Karen Bruzda
Also filed as: BRUZDA KAREN · BRUZDA KAREN J
11 granted patents·8 pending applications·85 citations·filing 2008–2024
88Inventor score
Top patents by PatentIndex Score
19 records- 0190US9771508B2Thermal interface materials including thermally reversible gelsLAIRD TECHNOLOGIES INC·Filed 2016·Granted Sep 26, 2017·8 cites·21 claims
- 0290US9260645B2Thermal interface materials including thermally reversible gelsBRUZDA KAREN J·Filed 2010·Granted Feb 16, 2016·28 cites·10 claims
- 0389US8445102B2Thermal interface material with thin transfer film or metallizationSTRADER JASON L·Filed 2008·Granted May 21, 2013·27 cites·33 claims
- 0486US10087351B2Materials including thermally reversible gelsLAIRD TECHNOLOGIES INC·Filed 2017·Granted Oct 2, 2018·4 cites·24 claims
- 0586US9795059B2Thermal interface materials with thin film or metallizationLAIRD TECHNOLOGIES INC·Filed 2013·Granted Oct 17, 2017·9 cites·20 claims
- 0680US9828539B2Thermal interface materials with low secant modulus of elasticity and high thermal conductivityLAIRD TECHNOLOGIES INC·Filed 2016·Granted Nov 28, 2017·4 cites·18 claims
- 0773US9515004B2Thermal interface materialsLAIRD TECHNOLOGIES INC·Filed 2013·Granted Dec 6, 2016·3 cites·20 claims
- 0862US10155896B2Thermal interface materials with low secant modulus of elasticity and high thermal conductivityLAIRD TECHNOLOGIES INC·Filed 2017·Granted Dec 18, 2018·1 cites·19 claims
- 0960US10306817B2Thermal management and/or EMI mitigation materials with custom colored exterior surfacesLAIRD TECHNOLOGIES INC·Filed 2018·Granted May 28, 2019·1 cites·17 claims
- 1059US2025098121A1Non-Condensing Thermal Materials With Low Sulfur ContentLAIRD TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1155US2010256280A1Methods of forming resin and filler composite systemsLAIRD TECHNOLOGIES INC·Filed 2009·Application pending·0 cites
- 1254US2024276690A1Thermally-Conductive Electromagnetic Interference (EMI) AbsorbersLAIRD TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1353US11955438B2Thermally-conductive electromagnetic interference (EMI) absorbersLAIRD TECHNOLOGIES INC·Filed 2021·Granted Apr 9, 2024·0 cites·23 claims
- 1451US2019023962A1Materials Including Thermally Reversible GelsLAIRD TECHNOLOGIES INC·Filed 2018·Application pending·0 cites
- 1544US2015334871A1Thermal interface materials with thin film sealantsLAIRD TECHNOLOGIES INC·Filed 2014·Application pending·0 cites
- 1642US10692797B2Thermal interface materials with low secant modulus of elasticity and high thermal conductivityLAIRD TECHNOLOGIES INC·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1739US2012080639A1Potato shaped graphite filler, thermal interface materials and emi shieldingBRUZDA KAREN·Filed 2010·Application pending·0 cites
- 1838US2019221524A1Thermal management and/or emi mitigation materials having increased contrast and presence detectionLAIRD TECHNOLOGIES INC·Filed 2018·Application pending·0 cites
- 1937US2012292005A1Thermal interface materials and methods for processing the sameBRUZDA KAREN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →