Inventor · disambiguated record
Kai Chong Chan
Also filed as: CHAN KAI CHONG
13 granted patents·14 pending applications·100 citations·filing 2006–2024
90Inventor score
Files withSTATS CHIPPAC PTE LTD12GLOBALFOUNDRIES SG PTE LTD6INFINEON TECHNOLOGIES AG5YEO ALFRED2CHAN KAI CHONG1
Top patents by PatentIndex Score
27 records- 0194US7619304B2Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 17, 2009·43 cites·8 claims
- 0289US9768089B2Wafer stack protection sealGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Sep 19, 2017·8 cites·20 claims
- 0389US7816235B2Semiconductor package and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 19, 2010·14 cites·12 claims
- 0485US9761561B2Edge structure for backgrinding asymmetrical bonded waferGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Sep 12, 2017·5 cites·20 claims
- 0581US11444045B2Bonding structures of semiconductor devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2020·Granted Sep 13, 2022·1 cites·20 claims
- 0681US8048761B2Fabricating method for crack stop structure enhancement of integrated circuit seal ringGLOBALFOUNDRIES SG PTE LTD·Filed 2009·Granted Nov 1, 2011·11 cites·20 claims
- 0778US7452747B2Semiconductor package with contact support layer and method to produce the packageINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 18, 2008·9 cites·8 claims
- 0868US9406577B2Wafer stack protection sealGLOBAL FOUNDRIES SINGAPORE PTE LTD·Filed 2014·Granted Aug 2, 2016·3 cites·20 claims
- 0966US7892963B2Integrated circuit packaging system and method of manufacture thereofGLOBALFOUNDRIES SG PTE LTD·Filed 2009·Granted Feb 22, 2011·4 cites·20 claims
- 1061US2025226334A1Semiconductor Device and Method of Making a Molded IPD-CoWSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1160US2025336790A1Semiconductor Device and Method of Making a Wafer-Level SubstrateSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1260US2025316659A1Semiconductor Devices and Methods of Making Semiconductor Devices Having Embedded Photonic Bridge DieSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1360US2025329624A1Semiconductor Device and Method of Forming Encapsulated Interconnect Structure for Embedded Photonic Bridge DieSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1460US2025149454A1Semiconductor Device and Methods of Making and Using Pre-Molded Bridge DieSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1559US2025273552A1Semiconductor Device and Method of Forming Encapsulated Vertical Interconnect StructureSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1657US2025132291A1Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package StructureSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1755US2025087545A1Semiconductor Device and Method of Forming FOWLP with Pre-Molded Embedded Discrete Electrical ComponentSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 1854US2024178165A1Structure with copper bond pad and copper interconnectGLOBALFOUNDRIES SG PTE LTD·Filed 2022·Application pending·0 cites
- 1954US2025343195A1Semiconductor Devices and Methods of Making and Using Solder Bumps on FO-WLPSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 2051US8610266B2Semiconductor device for radio frequency applications and method for making the sameCHAN KAI CHONG·Filed 2006·Granted Dec 17, 2013·1 cites·12 claims
- 2151US2025219006A1Semiconductor Device and Method of Making a Chip-on-Wafer Underfill BarrierSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 2250US2025118643A1Semiconductor Device and Method of Inhibiting Creep of Underfill Material on Back Surface of Semiconductor DieSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 2349US8603909B2Integrated circuit packaging system with core region and bond pad and method of manufacture thereofYEO ALFRED·Filed 2009·Granted Dec 10, 2013·1 cites·20 claims
- 2449US2025006608A1Semiconductor Device and Method of Forming Inverted EWLB Package with Vertical E-Bar StructureSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 2548US8003448B2Semiconductor package and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2010·Granted Aug 23, 2011·0 cites·10 claims
- 2648US7535111B2Semiconductor component with semiconductor chip and adhesive film, and method for its productionINFINEON TECHNOLOGIES AG·Filed 2006·Granted May 19, 2009·0 cites·12 claims
- 2737US2012074519A1Crack stop structure enhancement of the integrated circuit seal ringYEO ALFRED·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →