Inventor · disambiguated record
Ka Fai Chang
Also filed as: CHANG KA FAI
14 granted patents·1 pending application·24 citations·filing 2017–2024
87Inventor score
Top patents by PatentIndex Score
15 records- 0191US11222884B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 11, 2022·5 cites·20 claims
- 0289US11756951B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·1 cites·20 claims
- 0389US11088084B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 10, 2021·2 cites·20 claims
- 0485US11018080B2Semiconductor package and method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2017·Granted May 25, 2021·11 cites·6 claims
- 0582US12027513B2Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 0682US10665550B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·2 cites·20 claims
- 0782US2024312978A1Layout design methodology for stacked devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0880US10971485B2Solenoid inductors within a multi-chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 6, 2021·3 cites·20 claims
- 0972US11545298B2Method of forming entangled inductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
- 1071US11694973B2Electromagnetic shielding metal-insulator-metal capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 1162US12009260B2Method and system of forming integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
- 1257US10943729B2Entangled inductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·16 claims
- 1354US10811316B2Method and system of forming integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 1440US10720339B2Fan-out wafer-level packaging method and the package produced thereofAGENCY SCIENCE TECH & RES·Filed 2017·Granted Jul 21, 2020·0 cites·15 claims
- 1530US11569146B2Semiconductor package and method of forming the sameAGENCY SCIENCE TECH & RES·Filed 2017·Granted Jan 31, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →