Inventor · disambiguated record
Kai-Fung Chang
Also filed as: CHANG KAI-FUNG
26 granted patents·8 pending applications·27 citations·filing 2013–2025
93Inventor score
Top patents by PatentIndex Score
34 records- 0189US11075238B2Method of manufacturing image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 0287US10367018B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 30, 2019·4 cites·14 claims
- 0383US9540231B2MEMS device with a bonding layer embedded in the capTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 10, 2017·4 cites·20 claims
- 0482US10734429B2Pad structure for backside illuminated (BSI) image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·3 cites·20 claims
- 0582US10343895B2Micro-electro-mechanical system (MEMS) structure including isolation ring at sidewalls of semiconductor via and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·2 cites·20 claims
- 0680US2024373753A1Integrated heater (and related method) to recover degraded piezoelectric device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0779US9926190B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 27, 2018·3 cites·20 claims
- 0879US2025048660A1Getter layer for hydrogen in a mim deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0978US12082505B2Integrated heater (and related method) to recover degraded piezoelectric device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 1077US10150664B2Microelectromechanical systems (MEMS) stopper structure for stiction improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 11, 2018·3 cites·20 claims
- 1176US10109666B2Pad structure for backside illuminated (BSI) image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 1276US2025349799A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1374US10112822B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 30, 2018·1 cites·20 claims
- 1473US12166067B2Titanium layer as getter layer for hydrogen in a MIM deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 1570US2025285953A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1668US11513287B2Waveguide structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1766US11730058B2Integrated heater (and related method) to recover degraded piezoelectric device performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
- 1864US10865100B2Method for forming micro-electro-mechanical system (MEMS) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1963US12334424B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2060US11322580B2Titanium layer as getter layer for hydrogen in a MIM deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 2159US10712500B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 2258US2025079251A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2357US8991234B2Valproic acid biosensor and method for measuring concentration of valproic acidUNIV NAT TAIWAN·Filed 2013·Granted Mar 31, 2015·0 cites·11 claims
- 2456US10266400B2MEMS device with multi pressureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 2556US2024404932A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2655US12512384B2Semiconductor package with electrically conductive structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2755US9764948B2MEMS cap with multi pressureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·0 cites·20 claims
- 2853US12354929B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 2953US2024371827A1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3053US2024113032A1Packaged interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3150US10981779B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 3247US11289568B2Reduction of electric field enhanced moisture penetration by metal shieldingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 3347US9868630B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·20 claims
- 3444US10861929B2Electronic device including a capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →