Inventor · disambiguated record
Kai-Heng Chen
Also filed as: CHEN KAI-HENG
1 granted patent·1 pending application·0 citations·filing 2021–2025
13Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD2
Top patents by PatentIndex Score
2 records- 0163US12230593B2Wafer level package with polymer layer delamination prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 0262US2025157955A1Wafer level package with polymer layer delamination prevention design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →