Inventor · disambiguated record
Kai-Cheng Chen
Also filed as: CHEN KAI · CHEN KAI-CHENG
1 granted patent·2 pending applications·0 citations·filing 2021–2023
13Inventor score
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3 records- 0164US11616030B2Methods for making three-dimensional moduleUNIV SOUTHERN SCI & TECH·Filed 2021·Granted Mar 28, 2023·0 cites·10 claims
- 0254US2025118690A1Dielectric structure for high speed interconnect and reliability enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0353US2024421115A1Hybrid underfill structures for multi-die packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →