Inventor · disambiguated record
Kai-Fang Cheng
Also filed as: CHENG KAI-FANG
33 granted patents·22 pending applications·26 citations·filing 2009–2025
94Inventor score
Top patents by PatentIndex Score
55 records- 0192US10211097B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 19, 2019·7 cites·7 claims
- 0292US9818690B2Self-aligned interconnection structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 14, 2017·9 cites·20 claims
- 0387US9659857B2Semiconductor structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 23, 2017·6 cites·19 claims
- 0483US11658092B2Thermal interconnect structure for thermal management of electrical interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·1 cites·20 claims
- 0581US12205946B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0681US11830808B2Semiconductor structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 0779US2025349532A1Heat dissipation for field effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0879US2025046673A1Thermal interconnect structure for thermal management of electrical interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0979US2025364319A1Semiconductor structure with air gap and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US2025357349A1Interconnect structure with low capacitance and high thermal conductivityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1178US12165945B2Thermal interconnect structure for thermal management of electrical interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1278US2025336669A1Method for manufacturing semiconductor structure with material in monocrystalline phaseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1377US12176247B2Metal oxide composite as etch stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 1477US9892946B1Processing apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 13, 2018·2 cites·20 claims
- 1577US2025357198A1Etch stop layer for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1676US12484310B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1774US11328991B2Semiconductor structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·0 cites·20 claims
- 1874US2024387364A1Semiconductor interconnection structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1974US2025140698A1Interconnect structure with low capacitance and high thermal conductivityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2074US2024395700A1Semiconductor interconnection structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2174US2025309105A1Semiconductor interconnection structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2273US2025309041A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2372US12387928B2Method for manufacturing semiconductor structure with material in monocrystalline phaseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 2472US2025118548A1Heat dissipation for field effect transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2571US12424485B2Semiconductor structure with air gap and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 2670US11923357B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 2768US12412804B2Semiconductor structure with improved heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 2868US11450566B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·21 claims
- 2967US12080650B1Interconnect structure with low capacitance and high thermal conductivityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 3067US2024332070A1Etch stop layer for interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3166US12334431B2Semiconductor interconnection structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·19 claims
- 3264US12431426B2Semiconductor interconnection structures comprising a resistor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 30, 2025·0 cites·20 claims
- 3364US11315828B2Metal oxide composite as etch stop layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·0 cites·20 claims
- 3464US10521879B2Overlaying multi-source media in VRAMUBITUS INC·Filed 2019·Granted Dec 31, 2019·1 cites·12 claims
- 3563US12154850B2Semiconductor interconnection structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 26, 2024·0 cites·20 claims
- 3661US10700000B2Semiconductor structure and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 30, 2020·0 cites·20 claims
- 3760US10983278B2Adhesion promoter apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 3860US2025273511A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3959US2025210571A1Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4058US10867847B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 4158US2025112088A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4257US11848198B2Method for manufacturing semiconductor device having low-k carbon-containing dielectric layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 4356US10082626B2Adhesion promoter apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 25, 2018·0 cites·20 claims
- 4456US2024387250A1Self-aligned interconnection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4556US2024413010A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4655US11049811B2Forming interlayer dielectric material by spin-on metal oxide depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 29, 2021·0 cites·20 claims
- 4754US10090245B2Semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·0 cites·20 claims
- 4854US2024087980A1Etching-damage-free intermetal dielectric layer with thermal dissipation featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4952US2024038666A1Interconnect layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 5051US2024038665A1Interconnection structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →