Inventor · disambiguated record
Kang Rim Choi
Also filed as: CHOI KANG RIM
16 granted patents·3 pending applications·296 citations·filing 1998–2020
94Inventor score
Top patents by PatentIndex Score
19 records- 0192US8455987B1Electrically isolated power semiconductor package with optimized layoutSPANN THOMAS·Filed 2010·Granted Jun 4, 2013·49 cites·14 claims
- 0291US6731002B2High frequency power device with a plastic molded package and direct bonded substrateIXYS CORP·Filed 2001·Granted May 4, 2004·68 cites·24 claims
- 0388US10720376B2Discrete power transistor package having solderless DBC to leadframe attachLITTELFUSE INC·Filed 2018·Granted Jul 21, 2020·4 cites·7 claims
- 0484US6404065B1Electrically isolated power semiconductor packageI XYS CORP·Filed 1998·Granted Jun 11, 2002·74 cites·20 claims
- 0580US7005734B2Double-sided cooling isolated packaged power semiconductor deviceIXYS CORP·Filed 2003·Granted Feb 28, 2006·28 cites·18 claims
- 0676US6583505B2Electrically isolated power device packageIXYS CORP·Filed 2002·Granted Jun 24, 2003·20 cites·22 claims
- 0773US9842795B2Lead and lead frame for power packageIXYS CORP·Filed 2014·Granted Dec 12, 2017·2 cites·20 claims
- 0873US6727585B2Power device with a plastic molded package and direct bonded substrateIXYS CORP·Filed 2002·Granted Apr 27, 2004·20 cites·22 claims
- 0973US6710463B2Electrically isolated power semiconductor packageIXYS CORP·Filed 2001·Granted Mar 23, 2004·16 cites·25 claims
- 1069US11387162B2Discrete power transistor package having solderless DBC to leadframe attachIXYS LLC·Filed 2020·Granted Jul 12, 2022·0 cites·7 claims
- 1169US8901723B2Electrically isolated power semiconductor package with optimized layoutIXYS CORP·Filed 2013·Granted Dec 2, 2014·2 cites·19 claims
- 1268US6534343B2Method of making electrically isolated power semiconductor packageIXYS CORP·Filed 2001·Granted Mar 18, 2003·11 cites·5 claims
- 1365US7459659B2Induction heating circuit and winding method for heating coilsIXYS CORP·Filed 2007·Granted Dec 2, 2008·2 cites·10 claims
- 1457US10763201B2Lead and lead frame for power packageLITTELFUSE INC·Filed 2017·Granted Sep 1, 2020·0 cites·18 claims
- 1555US8796837B2Lead and lead frame for power packageZOMMER NATHAN·Filed 2009·Granted Aug 5, 2014·0 cites·10 claims
- 1654US9177888B2Electrically isolated power semiconductor package with optimized layoutIXYS CORP·Filed 2014·Granted Nov 3, 2015·0 cites·20 claims
- 1754US2017178998A1Discrete Power Transistor Package Having Solderless DBC To Leadframe AttachIXYS CORP·Filed 2017·Application pending·0 cites
- 1850US2013175704A1Discrete power transistor package having solderless dbc to leadframe attachJEUN GI-YOUNG·Filed 2012·Application pending·0 cites
- 1939US2003186483A1Electrically isolated power device packageIXYS CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →