Inventor · disambiguated record
Kang Wei Chou
Also filed as: CHOU KANG WEI · CHOU KANG WEI WEI
0 granted patents·6 pending applications·0 citations·filing 2016–2025
Files withHENKEL AG & CO KGAA6
Top patents by PatentIndex Score
6 records- 0169US2025115788A1Two component (2k) curable adhesive compositionHENKEL AG & CO KGAA·Filed 2024·Application pending·0 cites
- 0269US2023118005A1Electrochemically debondable adhesive compositionHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0368US2022332904A1Thiol/isocyanate/(poly-)ene formulations for additive manufacturingHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0457US2022186067A1Thiol-isocyanate-epoxide formulations for additive manufacturingHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0553US2025215291A1Curable and electrically debondable one-component (1K) structural adhesive compositionHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 0634US2017018325A1Sinterable metal particles and the use thereof in electronics applicationsHENKEL AG & CO KGAA·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →