Inventor · disambiguated record

Kai-Yi Chu

Also filed as: CHU KAI-YI

2 granted patents·2 pending applications·1 citations·filing 2020–2025

35Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD4

Top patents by PatentIndex Score

4 records

0179US11217524B1Interconnect structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 4, 2022·1 cites·20 claims
0277US2025357348A1Barrier free tungsten liner in contact plugs and the method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0367US11817384B2Interconnect structure and manufacturing method for the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
0467US2024355740A1Barrier Free Tungsten Liner in Contact Plugs and The Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →