Inventor · disambiguated record
Kay Stephan Essig
Also filed as: ESSIG KAY S · ESSIG KAY STEPHAN
3 granted patents·1 pending application·14 citations·filing 2011–2020
57Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0185US8487426B2Semiconductor package with embedded die and manufacturing methods thereofESSIG KAY STEPHAN·Filed 2011·Granted Jul 16, 2013·14 cites·20 claims
- 0254US11462484B2Electronic package with wettable flank and shielding layer and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 4, 2022·0 cites·13 claims
- 0352US11616007B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 28, 2023·0 cites·18 claims
- 0434US2013037929A1Stackable wafer level packages and related methodsESSIG KAY S·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →