Inventor · disambiguated record
Kai Ethner
Also filed as: ETHNER KAI
1 granted patent·1 pending application·0 citations·filing 2023–2023
9Inventor score
Files withHENKEL AG & CO KGAA2
Top patents by PatentIndex Score
2 records- 0164US12350861B2Device and method for laminating a substrate with a thermoplastic filmHENKEL AG & CO KGAA·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0251US2023256657A1Device and Method for Laminating a Substrate with a Thermoplastic FilmHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →