Inventor · disambiguated record
Kazuhiro Fujimaki
Also filed as: FUJIMAKI KAZUHIRO
30 granted patents·8 pending applications·292 citations·filing 1998–2021
96Inventor score
Top patents by PatentIndex Score
38 records- 0187US6916595B2Image recording materialFUJI PHOTO FILM CO LTD·Filed 2001·Granted Jul 12, 2005·60 cites·10 claims
- 0287US6475700B1Lithographic printing plate precursorFUJI PHOTO FILM CO LTD·Filed 2000·Granted Nov 5, 2002·27 cites·7 claims
- 0386US7381517B2Curable composition and image forming material containing the sameFUJIFILM CORP·Filed 2005·Granted Jun 3, 2008·4 cites·5 claims
- 0485US6720125B2Image recording materialFUJI PHOTO FILM CO LTD·Filed 2002·Granted Apr 13, 2004·17 cites·20 claims
- 0585US6702437B2Image recording materialFUJI PHOTO FILM CO LTD·Filed 2002·Granted Mar 9, 2004·15 cites·16 claims
- 0683US8362140B2Pigment-dispersed composition, colored photosensitive composition, photocurable composition, color filter, liquid crystal display device, and solid-state image pickup deviceFUJIFILM CORP·Filed 2009·Granted Jan 29, 2013·6 cites·9 claims
- 0783US7442485B2Lithographic process involving on press developmentFUJIFILM CORP·Filed 2004·Granted Oct 28, 2008·14 cites·20 claims
- 0881US8278386B2Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unitNAGATA YUZO·Filed 2009·Granted Oct 2, 2012·6 cites·20 claims
- 0979US7105276B2Image recording materialFUJI PHOTO FILM CO LTD·Filed 2005·Granted Sep 12, 2006·1 cites·12 claims
- 1079US6838222B2Photopolymerizable compositionFUJI PHOTO FILM CO LTD·Filed 2002·Granted Jan 4, 2005·37 cites·24 claims
- 1176US6902864B2Polymerizable compositionFUJI PHOTO FILM CO LTD·Filed 2003·Granted Jun 7, 2005·9 cites·19 claims
- 1273US6727044B1Method for producing lithographic printing plate, lithographic printing original plate for laser scan exposure, and photopolymerizable compositionFUJI PHOTO FILM CO LTD·Filed 1999·Granted Apr 27, 2004·34 cites·6 claims
- 1372US7338748B2Polymerizable composition and planographic printing plate precursorFUJIFILM CORP·Filed 2003·Granted Mar 4, 2008·6 cites·18 claims
- 1471US8343709B2Processed pigment, pigment-dispersed composition, colored photosensitive composition, color filter, liquid crystal display element, and solid image pickup elementFUJIFILM CORP·Filed 2008·Granted Jan 1, 2013·2 cites·15 claims
- 1570US8728687B2Resin, pigment dispersion, colored curable composition, color filter produced using the same, and method for producing the sameKANEKO YUSHI·Filed 2009·Granted May 20, 2014·2 cites·13 claims
- 1669US6844137B2Image recording materialFUJI PHOTO FILM CO LTD·Filed 2001·Granted Jan 18, 2005·6 cites·15 claims
- 1767US7883827B2Polymerizable composition and planographic printing plate precursorFUJIFILM CORP·Filed 2007·Granted Feb 8, 2011·0 cites·1 claims
- 1867US7351773B2Polymerizable compositionFUJIFILM CORP·Filed 2004·Granted Apr 1, 2008·7 cites·12 claims
- 1966US9966295B2Temporary bonding laminates for use in manufacture of semiconductor devices and method for manufacturing semiconductor devicesFUJIFILM CORP·Filed 2015·Granted May 8, 2018·1 cites·15 claims
- 2066US6153660APhotopolymerizable compositionFUJI PHOTO FILM CO LTD·Filed 1998·Granted Nov 28, 2000·20 cites·3 claims
- 2165US9177921B2Manufacturing method of semiconductor deviceFUJIFILM CORP·Filed 2014·Granted Nov 3, 2015·1 cites·14 claims
- 2265US8603708B2Dye-containing negative curable composition, color filter using same, method of producing color filter, and solid-state imaging deviceMURAKAMI YOUSUKE·Filed 2009·Granted Dec 10, 2013·2 cites·17 claims
- 2365US6653050B2Image-recording materialFUJI PHOTO FILM CO LTD·Filed 2002·Granted Nov 25, 2003·4 cites·17 claims
- 2462US8273167B2Pigment dispersion composition, curable color composition, color filter and method for producing the sameSUGIHARA KOICHI·Filed 2008·Granted Sep 25, 2012·1 cites·8 claims
- 2561US7416835B2Polymerizable compositionFUJIFILM CORP·Filed 2004·Granted Aug 26, 2008·6 cites·7 claims
- 2659US2021356865A1Water-developable flexographic printing plate precursor, flexographic printing plate, and photosensitive resin compositionFUJIFILM CORP·Filed 2021·Application pending·0 cites
- 2755US2021165322A1Water-developable flexographic printing plate precursor, flexographic printing plate, and photosensitive resin compositionFUJIFILM CORP·Filed 2021·Application pending·0 cites
- 2854US7771916B2Polymerizable composition and planographic printing plate precursorFUJIFILM CORP·Filed 2005·Granted Aug 10, 2010·0 cites·14 claims
- 2954US7569328B2Resin composition and thermo/photosensitive compositionFUJIFILM CORP·Filed 2003·Granted Aug 4, 2009·1 cites·15 claims
- 3054US6919411B2Process for producing polymer compoundFUJI PHOTO FILM CO LTD·Filed 2003·Granted Jul 19, 2005·3 cites·7 claims
- 3149US7455954B2Lithographic printing plate precursor and polymerizable compositionFUJIFILM CORP·Filed 2004·Granted Nov 25, 2008·0 cites·12 claims
- 3247US2016075922A1Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the sameFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 3346US2015284603A1Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the sameFUJIFILM CORP·Filed 2015·Application pending·0 cites
- 3446US2015093879A1Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the sameFUJIFILM CORP·Filed 2014·Application pending·0 cites
- 3545US2014318697A1Manufacturing method of semiconductor deviceFUJIFILM CORP·Filed 2014·Application pending·0 cites
- 3637US9505953B2Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the sameFUJIFILM CORP·Filed 2015·Granted Nov 29, 2016·0 cites·5 claims
- 3736US2008044763A1Resin composition and thermo/photosensitive compositionFUJIFILM CORP·Filed 2007·Application pending·0 cites
- 3834US2015184035A1Temporary bonding layer for production of semiconductor device, stack and production method of semiconductor deviceFUJIFILM CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →