Inventor · disambiguated record
Kazuhiko Fujio
Also filed as: FUJIO KAZUHIKO
8 granted patents·4 pending applications·6 citations·filing 2011–2023
75Inventor score
Top patents by PatentIndex Score
12 records- 0175US9448014B2Channel member, and heat exchanger, semiconductor unit, and semiconductor manufacturing apparatus including the sameKYOCERA CORP·Filed 2012·Granted Sep 20, 2016·5 cites·14 claims
- 0259US10627173B2Flow path member, and heat exchanger and semiconductor manufacturing apparatus using sameKYOCERA CORP·Filed 2013·Granted Apr 21, 2020·1 cites·10 claims
- 0356US10566264B2Flow path member and semiconductor moduleKYOCERA CORP·Filed 2016·Granted Feb 18, 2020·0 cites·8 claims
- 0455US10697707B2Heat exchange member and heat exchangerKYOCERA CORP·Filed 2014·Granted Jun 30, 2020·0 cites·14 claims
- 0552US2025293001A1Channel structure, semiconductor manufacturing device, and method for manufacturing channel structureKYOCERA CORP·Filed 2023·Application pending·0 cites
- 0649US2015153116A1Flow path member, and heat exchanger and semiconductor manufacturing device using sameKYOCERA CORP·Filed 2013·Application pending·0 cites
- 0744US10103047B2Flow path member, heat exchanger including the flow path member, and semiconductor manufacturing apparatus including the flow path memberKYOCERA CORP·Filed 2013·Granted Oct 16, 2018·0 cites·9 claims
- 0841US11961747B2Heater and heater systemKYOCERA CORP·Filed 2019·Granted Apr 16, 2024·0 cites·12 claims
- 0941US9953898B2Flow channel member, and heat exchanger and semiconductor module each using sameKYOCERA CORP·Filed 2015·Granted Apr 24, 2018·0 cites·7 claims
- 1040US12145891B2Ceramic structural bodyKYOCERA CORP·Filed 2019·Granted Nov 19, 2024·0 cites·4 claims
- 1138US2017219302A1Heat exchangerKYOCERA CORP·Filed 2015·Application pending·0 cites
- 1235US2013088837A1Flow channel member, and heat exchanger using the same, and electronic component deviceTSUBOKAWA KENJI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →