Inventor · disambiguated record
Kazuki Fukada
Also filed as: FUKADA KAZUKI
17 granted patents·3 pending applications·56 citations·filing 2002–2025
90Inventor score
Files withPANASONIC IP MAN CO LTD7YOSHIDA HIDEHIRO5FUKADA KAZUKI3MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3PANASONIC CORP2
Top patents by PatentIndex Score
20 records- 0192US8567921B2Ink-jet apparatusYOSHIDA HIDEHIRO·Filed 2011·Granted Oct 29, 2013·8 cites·11 claims
- 0288US10913088B2Coating nozzle head, and liquid-applying apparatus including the samePANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 9, 2021·4 cites·7 claims
- 0383US8727507B2Ink-jet apparatusFUKADA KAZUKI·Filed 2012·Granted May 20, 2014·4 cites·6 claims
- 0482US8602533B2Ink jet head and ink jet device having the sameFUKADA KAZUKI·Filed 2011·Granted Dec 10, 2013·4 cites·3 claims
- 0580US7357288B2Component connecting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 15, 2008·26 cites·12 claims
- 0675US2025353033A1Droplet ejecting devicePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 0773US8827427B2Ink-jet head and ink-jet apparatusYOSHIDA HIDEHIRO·Filed 2011·Granted Sep 9, 2014·2 cites·9 claims
- 0869US9080728B2Wiping device, ink-jet device, and wiping methodPANASONIC CORP·Filed 2014·Granted Jul 14, 2015·1 cites·12 claims
- 0956US2024286404A1Inkjet apparatus and printerPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 1054US6995342B2Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Feb 7, 2006·5 cites·3 claims
- 1153US11198294B2Inkjet head, inkjet coating device, and inkjet coating methodPANASONIC IP MAN CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·10 claims
- 1253US9855747B2Inkjet head and inkjet devicePANASONIC IP MAN CO LTD·Filed 2015·Granted Jan 2, 2018·0 cites·13 claims
- 1346US10112389B2Inkjet head and coating apparatus using samePANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 30, 2018·0 cites·13 claims
- 1446US6797926B2Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 28, 2004·2 cites·26 claims
- 1545US8646878B2Ink-jet headFUKADA KAZUKI·Filed 2012·Granted Feb 11, 2014·0 cites·17 claims
- 1642US8567925B2Ink-jet head, ink-jet apparatus, and method of manufacturing the sameYOSHIDA HIDEHIRO·Filed 2011·Granted Oct 29, 2013·0 cites·7 claims
- 1742US8303080B2Ink-jet head and ink-jet apparatusYOSHIDA HIDEHIRO·Filed 2011·Granted Nov 6, 2012·0 cites·6 claims
- 1841US8579420B2Ink-jet apparatusYOSHIDA HIDEHIRO·Filed 2011·Granted Nov 12, 2013·0 cites·10 claims
- 1940US7659148B2Bonding method and apparatusPANASONIC CORP·Filed 2005·Granted Feb 9, 2010·0 cites·13 claims
- 2040US2021260680A1Liquid agent supply device and liquid agent supply methodPANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →