Inventor · disambiguated record
Kaori Fuse
Also filed as: FUSE KAORI
7 granted patents·14 pending applications·2 citations·filing 2010–2025
70Inventor score
Top patents by PatentIndex Score
21 records- 0191US12183782B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted Dec 31, 2024·2 cites·17 claims
- 0273US2025280551A1Semiconductor deviceTOSHIBA KK·Filed 2025·Application pending·0 cites
- 0367US2025194175A1Semiconductor deviceTOSHIBA KK·Filed 2025·Application pending·0 cites
- 0460US12336267B2Semiconductor deviceTOSHIBA KK·Filed 2021·Granted Jun 17, 2025·0 cites·10 claims
- 0560US2025318165A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0658US2022293725A1Semiconductor deviceTOSHIBA KK·Filed 2021·Application pending·0 cites
- 0756US12113126B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted Oct 8, 2024·0 cites·16 claims
- 0852US2024097021A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2023·Application pending·0 cites
- 0952US2024079448A1Semiconductor deviceTOSHIBA KK·Filed 2023·Application pending·0 cites
- 1052US2024097012A1Semiconductor deviceTOSHIBA KK·Filed 2023·Application pending·0 cites
- 1151US2023307555A1Semiconductor deviceTOSHIBA KK·Filed 2022·Application pending·0 cites
- 1249US11532704B2Semiconductor deviceTOSHIBA KK·Filed 2020·Granted Dec 20, 2022·0 cites·17 claims
- 1348US11348822B2Support substrate, method for peeling off support substrate, and method for manufacturing semiconductor deviceTOSHIBA KK·Filed 2020·Granted May 31, 2022·0 cites·15 claims
- 1446US11575031B2Semiconductor element and semiconductor deviceTOSHIBA KK·Filed 2021·Granted Feb 7, 2023·0 cites·11 claims
- 1544US12363929B2Semiconductor deviceTOSHIBA KK·Filed 2020·Granted Jul 15, 2025·0 cites·7 claims
- 1640US2014287563A1Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1739US2014035105A1Semiconductor device, method for manufacturing semiconductor device, and base member for semiconductor device formationTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1838US2014284759A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1937US2011220970A1Solid state imaging deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 2036US2018277667A1Semiconductor deviceTOSHIBA KK·Filed 2017·Application pending·0 cites
- 2136US2012080776A1Semiconductor device and method of manufacturing the sameKOMATSU AKIRA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →