Inventor · disambiguated record
Kazuki Harano
Also filed as: HARANO KAZUKI
5 granted patents·5 pending applications·2 citations·filing 2019–2024
62Inventor score
Top patents by PatentIndex Score
10 records- 0178US10913754B2Lanthanum compound and methods of forming thin film and integrated circuit device using the lanthanum compoundSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 9, 2021·2 cites·15 claims
- 0266US2025154648A1Precursor for forming metal thin film, manufacturing method using the same, and metal thin film manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0361US12378272B2Yttrium compound and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·11 claims
- 0457US12473309B2Organometallic compound and method of manufacturing integrated circuit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 0556US2024067663A1Yttrium compound, source material for forming yttrium-containing film, and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0655US11746121B2Molybdenum compound and method of manufacturing integrated circuit device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 0755US2022324887A1Organometallic adduct compound and method of manufacturing integrated circuit device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0854US11524973B2Metal compounds and methods of fabricating semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·20 claims
- 0952US2021380622A1Materials for fabricating thin films, methods of fabricating thin films using the same, and equipment for fabricating thin films using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1043US2022213592A1Raw material for forming thin film, method for producing thin film, and scandium compoundADEKA CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →