Inventor · disambiguated record
Kazushi Hatauchi
Also filed as: HATAUCHI KAZUSHI
8 granted patents·2 pending applications·130 citations·filing 1995–2010
85Inventor score
Technology areasH10W
Files withRENESAS TECH CORP4MITSUBISHI ELECTRIC CORP3MISUMI KAZUYUKI1RENESAS ELECTRONICS CORP1YAMASHITA KUNIHIRO1
Top patents by PatentIndex Score
10 records- 0186US5548482ASemiconductor integrated circuit apparatus including clamped heat sinkMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Aug 20, 1996·98 cites·2 claims
- 0268US8318548B2Method for manufacturing semiconductor deviceYAMASHITA KUNIHIRO·Filed 2010·Granted Nov 27, 2012·5 cites·12 claims
- 0363US6858920B2Semiconductor device with stacked semiconductor elementsRENESAS TECH CORP·Filed 2003·Granted Feb 22, 2005·13 cites·3 claims
- 0461US7915719B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Mar 29, 2011·2 cites·16 claims
- 0557US8097942B2Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method thereforMISUMI KAZUYUKI·Filed 2009·Granted Jan 17, 2012·2 cites·4 claims
- 0651US6475829B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 5, 2002·5 cites·4 claims
- 0751US6441472B1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Aug 27, 2002·5 cites·4 claims
- 0845US2010109148A1Semiconductor deviceRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 0941US7763966B2Resin molded semiconductor device and differential amplifier circuitRENESAS TECH CORP·Filed 2008·Granted Jul 27, 2010·0 cites·2 claims
- 1036US2005001292A1Semiconductor device and lead frameRENESAS TECH CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →