Inventor · disambiguated record
Kai Herbst
Also filed as: HERBST KAI
4 granted patents·4 pending applications·1 citations·filing 2016–2018
55Inventor score
Files withHERAEUS DEUTSCHLAND GMBH & CO KG8
Top patents by PatentIndex Score
8 records- 0169US11021406B2Copper-ceramic compositeHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Granted Jun 1, 2021·1 cites·18 claims
- 0238US11021407B2Copper/ceramic compositeHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Granted Jun 1, 2021·0 cites·14 claims
- 0336US11498878B2Copper-ceramic compositeHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Granted Nov 15, 2022·0 cites·17 claims
- 0435US2020199029A1Logic power module with a thick-film paste mediated substrate bonded with metal or metal hybrid foilsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
- 0533US11584696B2Copper-ceramic compositeHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Granted Feb 21, 2023·0 cites·12 claims
- 0629US2021188718A1Copper-ceramic compositeHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Application pending·0 cites
- 0729US2019023619A1Copper-ceramic compositeHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Application pending·0 cites
- 0828US2019002359A1Thick-film paste mediated ceramics bonded with metal or metal hybrid foilsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →