Inventor · disambiguated record
Kazue Hirano
Also filed as: HIRANO KAZUE
0 granted patents·4 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Files withRESONAC CORP4
Top patents by PatentIndex Score
4 records- 0165US2025293105A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0265US2025259859A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0361US2025287514A1Method for manufacturing electronic component deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 0449US2025132219A1Semiconductor device, method for manufacturing semiconductor device, and thermally conductive sheet for semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →