Inventor · disambiguated record
Katsutoshi Hirashima
Also filed as: HIRASHIMA KATSUTOSHI
4 granted patents·1 pending application·14 citations·filing 2005–2010
68Inventor score
Top patents by PatentIndex Score
5 records- 0173US7910631B2Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin compositionNITTO DENKO CORP·Filed 2008·Granted Mar 22, 2011·6 cites·6 claims
- 0271US7239030B2Flexible wiring board for tape carrier package having improved flame resistanceUBE INDUSTRIES·Filed 2005·Granted Jul 3, 2007·6 cites·10 claims
- 0360US7491427B2Polyimidesiloxane solution compositionUBE INDUSTRIES·Filed 2005·Granted Feb 17, 2009·2 cites·11 claims
- 0436US2011084787A1Photosensitive resin composition, metal-base-containing circuit board production method employing the photosensitive resin composition, and metal-base-containing circuit boardNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 0527US8728705B2Negative photosensitive material, photosensitive board employing the negative photosensitive material, and negative pattern forming methodHIRASHIMA KATSUTOSHI·Filed 2010·Granted May 20, 2014·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Katsutoshi Hirashima files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →