Inventor · disambiguated record
Kaoru Hishiki
Also filed as: HISHIKI KAORU
15 granted patents·17 citations·filing 2014–2020
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0193US10847451B2Device for mounting semiconductor element, lead frame, and substrate for mounting semiconductor elementOHKUCHI MAT CO LTD·Filed 2020·Granted Nov 24, 2020·4 cites·7 claims
- 0290US10903150B2Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Jan 26, 2021·3 cites·7 claims
- 0390US10777492B1Substrate for mounting semiconductor elementOHKUCHI MAT CO LTD·Filed 2020·Granted Sep 15, 2020·3 cites·4 claims
- 0477US11062983B2Substrate for mounting semiconductor elementOHKUCHI MAT CO LTD·Filed 2020·Granted Jul 13, 2021·1 cites·4 claims
- 0571US10312187B2Multi-row wiring member for semiconductor device and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted Jun 4, 2019·2 cites·8 claims
- 0669US9735096B1Lead frame and method for manufacturing the sameSH MATERIALS CO LTD·Filed 2015·Granted Aug 15, 2017·3 cites·6 claims
- 0758US9735106B2Semiconductor lead frame, semiconductor package, and manufacturing method thereofSH MATERIALS CO LTD·Filed 2016·Granted Aug 15, 2017·1 cites·16 claims
- 0853US11404286B2Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·6 claims
- 0951US10811346B2Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Oct 20, 2020·0 cites·4 claims
- 1051US10763196B1Lead frameOHKUCHI MAT CO LTD·Filed 2020·Granted Sep 1, 2020·0 cites·4 claims
- 1140US10453782B2Multi-row wiring member for semiconductor device and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·8 claims
- 1238US9870930B2Method for producing substrate for mounting semiconductor elementSH MATERIALS CO LTD·Filed 2014·Granted Jan 16, 2018·0 cites·12 claims
- 1337US10763202B2Multi-row wiring member for semiconductor device and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·4 claims
- 1431US10727171B2Lead frameOHKUCHI MAT CO LTD·Filed 2017·Granted Jul 28, 2020·0 cites·8 claims
- 1528US10305007B2Multi-row LED wiring member and method for manufacturing the sameOHKUCHI MAT CO LTD·Filed 2017·Granted May 28, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →