Inventor · disambiguated record
Kanji Hosoki
Also filed as: HOSOKI KANJI
3 granted patents·66 citations·filing 2000–2000
73Inventor score
Technology areasB24B
Files withMITSUBISHI MATERIALS CORP3
Top patents by PatentIndex Score
3 records- 0186US6488573B1Polishing apparatus, polishing method and method of conditioning polishing padMITSUBISHI MATERIALS CORP·Filed 2000·Granted Dec 3, 2002·36 cites·22 claims
- 0272US6280306B1Wafer polishing apparatus and wafer manufacturing methodMITSUBISHI MATERIALS CORP·Filed 2000·Granted Aug 28, 2001·18 cites·8 claims
- 0364US6302772B1Apparatus and method for dressing a wafer polishing padMITSUBISHI MATERIALS CORP·Filed 2000·Granted Oct 16, 2001·12 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Kanji Hosoki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →