Inventor · disambiguated record

Katsuhiko Hotta

Also filed as: HOTTA KATSUHIKO

48 granted patents·8 pending applications·322 citations·filing 2000–2024

98Inventor score

Technology areasH10W H10P H01L

Files withRENESAS ELECTRONICS CORP21 RENESAS TECH CORP19 HOTTA KATSUHIKO6 HITACHI LTD2 HITACHI ULSI SYS CO LTD2

Top patents by PatentIndex Score

56 records

0197US11062938B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Jul 13, 2021·3 cites·9 claims
0295US9391022B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 12, 2016·8 cites·15 claims
0395US8704373B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 22, 2014·12 cites·16 claims
0494US10141257B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 27, 2018·6 cites·7 claims
0594US7629251B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Dec 8, 2009·16 cites·32 claims
0694US7557034B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Jul 7, 2009·17 cites·10 claims
0793US7932606B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Apr 26, 2011·14 cites·19 claims
0893US7208391B2Method of manufacturing a semiconductor integrated circuit device that includes forming an isolation trench around active regions and filling the trench with two insulating filmsRENESAS TECH CORP·Filed 2005·Granted Apr 24, 2007·19 cites·15 claims
0992US2025046653A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
1091US7354855B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Apr 8, 2008·12 cites·13 claims
1191US7074691B2Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating materialHITACHI ULSI SYSTEMS C O LTD·Filed 2005·Granted Jul 11, 2006·20 cites·12 claims
1289US11600522B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2021·Granted Mar 7, 2023·1 cites·11 claims
1387US6693008B1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2000·Granted Feb 17, 2004·29 cites·9 claims
1486US7602040B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Oct 13, 2009·11 cites·9 claims
1585US12154823B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Granted Nov 26, 2024·0 cites·12 claims
1684US8581415B2Semiconductor device and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2012·Granted Nov 12, 2013·3 cites·16 claims
1784US6838771B2Semiconductor device having conductor layers stacked on a substrateRENESAS TECH CORP·Filed 2003·Granted Jan 4, 2005·24 cites·20 claims
1883US7705462B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2009·Granted Apr 27, 2010·8 cites·10 claims
1983US7615848B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2008·Granted Nov 10, 2009·8 cites·17 claims
2081US7968966B2Semiconductor device with fuse and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2009·Granted Jun 28, 2011·7 cites·18 claims
2180US8513808B2Semiconductor device having trench-isolated element formation regionHOTTA KATSUHIKO·Filed 2011·Granted Aug 20, 2013·6 cites·13 claims
2280US7400046B2Semiconductor device with guard rings that are formed in each of the plural wiring layersRENESAS TECH CORP·Filed 2007·Granted Jul 15, 2008·6 cites·22 claims
2379US8373270B2Semiconductor integrated circuit device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 12, 2013·4 cites·18 claims
2479US7303986B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Dec 4, 2007·6 cites·22 claims
2578US7060589B2Method for manufacturing a semiconductor integrated circuit device that includes covering the bottom of an isolation trench with spin-on glass and etching back the spin-on glass to a predetermined depthHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jun 13, 2006·4 cites·13 claims
2676US8269309B2Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2011·Granted Sep 18, 2012·3 cites·4 claims
2776US7718269B2Semiconductor manufacturing method for inter-layer insulating filmRENESAS TECH CORP·Filed 2006·Granted May 18, 2010·6 cites·10 claims
2875US10796953B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2020·Granted Oct 6, 2020·0 cites·9 claims
2973US6833331B2Method of manufacturing semiconductor integrated circuit device having insulating film formed from liquid substance containing polymer of silicon, oxygen, and hydrogenHITACHI LTD·Filed 2002·Granted Dec 21, 2004·13 cites·10 claims
3072US8518821B2Semiconductor device and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2012·Granted Aug 27, 2013·1 cites·8 claims
3172US8487412B2Semiconductor device and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2011·Granted Jul 16, 2013·1 cites·19 claims
3271US7772700B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Aug 10, 2010·3 cites·14 claims
3371US7247525B2Method for manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Jul 24, 2007·3 cites·7 claims
3470US10600683B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2018·Granted Mar 24, 2020·0 cites·9 claims
3570US7419901B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·3 cites·5 claims
3669US6509277B1Method of manufacturing semiconductor integrated circuit device having insulatro film formed from liquid containing polymer of silicon, oxygen, and hydrogenHITACHI LTD·Filed 2000·Granted Jan 21, 2003·10 cites·26 claims
3767US6967407B2Semiconductor device and method of manufacturing the semiconductor deviceRENESAS TECH CORP·Filed 2001·Granted Nov 22, 2005·14 cites·14 claims
3866US7189637B2Method of manufacturing a semiconductor device having a multi-layered wiring structureHITACHI ULSI SYS CO LTD·Filed 2003·Granted Mar 13, 2007·9 cites·29 claims
3965US8686538B2Semiconductor device with a fuse formed by a damascene technique and a method of manufacturing the sameHOTTA KATSUHIKO·Filed 2012·Granted Apr 1, 2014·1 cites·8 claims
4064US7372154B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 13, 2008·7 cites·4 claims
4162US9899316B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·0 cites·10 claims
4262US9761487B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 12, 2017·1 cites·15 claims
4362US9048200B2Semiconductor integrated circuit device and method of manufacturing sameHOMMA TAKURO·Filed 2012·Granted Jun 2, 2015·1 cites·18 claims
4461US2014199831A1Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
4556US8350311B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jan 8, 2013·1 cites·18 claims
4655US9443817B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·1 cites·16 claims
4751US9536821B2Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jan 3, 2017·0 cites·14 claims
4851US7986041B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 26, 2011·0 cites·8 claims
4949US2007222043A1Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
5045US2010193958A1Semiconductor Device and a Method of Manufacturing the SameRENESAS TECH CORP·Filed 2010·Application pending·0 cites

Showing the top 50 of 56 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →