Inventor · disambiguated record
Kai-Chieh Hsieh
Also filed as: HSIEH KAI-CHIEH
24 granted patents·5 pending applications·22 citations·filing 2013–2021
91Inventor score
Files withCHUNGHWA PREC TEST TECH CO LTD29
Top patents by PatentIndex Score
29 records- 0195US11226354B1Probe card device and fence-like probe thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted Jan 18, 2022·6 cites·9 claims
- 0294US11460486B1Probe card device and spring-like probeCHUNGHWA PREC TEST TECH CO LTD·Filed 2021·Granted Oct 4, 2022·3 cites·10 claims
- 0392US11561244B2Board-like connector, dual-ring bridge of board-like connector, and wafer testing assemblyCHUNGHWA PREC TEST TECH CO LTD·Filed 2021·Granted Jan 24, 2023·2 cites·10 claims
- 0491US10845385B2Probe card deviceCHUNGHWA PREC TEST TECH CO LTD·Filed 2019·Granted Nov 24, 2020·5 cites·6 claims
- 0583US10060949B2Probe device of vertical probe cardCHUNGHWA PREC TEST TECH CO LTD·Filed 2017·Granted Aug 28, 2018·4 cites·13 claims
- 0680US10845387B2Probe card device and matching probe thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2019·Granted Nov 24, 2020·2 cites·10 claims
- 0753US11747395B2Board-like connector, single-arm bridge of board-like connector, and wafer testing assemblyCHUNGHWA PREC TEST TECH CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·10 claims
- 0852US11506685B1Probe card device and disposable adjustment film thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·10 claims
- 0951US11699871B2Board-like connector, dual-arm bridge of board-like connector, and wafer testing assemblyCHUNGHWA PREC TEST TECH CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 1051US11592466B2Probe card device and self-aligned probeCHUNGHWA PREC TEST TECH CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·8 claims
- 1150US11536744B2Probe card device and dual-arm probeCHUNGHWA PREC TEST TECH CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·8 claims
- 1248US11287446B2Split thin-film probe cardCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·6 claims
- 1348US10514390B2Probe structureCHUNGHWA PREC TEST TECH CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·16 claims
- 1447US11209461B2Probe card device and neck-like probe thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted Dec 28, 2021·0 cites·8 claims
- 1546US10845388B2Probe card device and probe head thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·10 claims
- 1645US11204371B2Probe card deviceCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·6 claims
- 1745US11175313B1Thin-film probe card and test module thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·10 claims
- 1845US11009526B2Probe card device and three-dimensional signal transfer structure thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2019·Granted May 18, 2021·0 cites·8 claims
- 1945US10775412B2Probe card testing device and testing deviceCHUNGHWA PREC TEST TECH CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·10 claims
- 2044US11073537B2Probe card deviceCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted Jul 27, 2021·0 cites·7 claims
- 2144US11009524B2High speed probe card device and rectangular probeCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted May 18, 2021·0 cites·10 claims
- 2244US2022011346A1Probe card device and fan-out probe thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Application pending·0 cites
- 2342US10705117B2Probe assembly and probe structure thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2018·Granted Jul 7, 2020·0 cites·9 claims
- 2439US10718791B2Probe assembly and probe structure thereofCHUNGHWA PREC TEST TECH CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·11 claims
- 2536US2014084955A1Fine pitch interposer structureCHUNGHWA PREC TEST TECH CO LTD·Filed 2013·Application pending·0 cites
- 2635US11175312B2Staggered probe cardCHUNGHWA PREC TEST TECH CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·7 claims
- 2733US2017367183A1Circuit board with via capacitor structure and manufacturing method for the sameCHUNGHWA PREC TEST TECH CO LTD·Filed 2017·Application pending·0 cites
- 2831US2016349315A1Multilayer interposer with high bonding strengthCHUNGHWA PREC TEST TECH CO LTD·Filed 2016·Application pending·0 cites
- 2928US2017315152A1Stack type test interface board assembly and method for manufacturing the sameCHUNGHWA PREC TEST TECH CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →