Inventor · disambiguated record
Kai-Shiung Hsu
Also filed as: HSU KAI-SHIUNG
16 granted patents·14 pending applications·14 citations·filing 2011–2025
88Inventor score
Top patents by PatentIndex Score
30 records- 0191US11315829B2Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·2 cites·20 claims
- 0290US2025357196A1Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0389US10161041B2Thermal chemical vapor deposition system and operating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·5 cites·18 claims
- 0485US12354908B2Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0585US2025293084A1Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0681US12444647B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 0781US9716044B2Interlayer dielectric structure with high aspect ratio process (HARP)CHANG JEN-CHI·Filed 2011·Granted Jul 25, 2017·6 cites·20 claims
- 0879US11967522B2Amorphous layers for reducing copper diffusion and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·20 claims
- 0979US10626499B2Deposition device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·1 cites·20 claims
- 1078US2025349609A1Etch stop layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1176US2024395609A1Method of manufacturing semiconductor device and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1276US2024312792A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1375US12354907B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 1474US12148656B2Method of manufacturing semiconductor device and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1572US12020947B2Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1671US2025323071A1Slit valve air curtainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1771US2025105055A1Etch stop layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1870US11264273B2Electron migration control in interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 1968US2024384404A1Semiconductor manufacturing apparatus with improved production yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2066US12406867B2Split valve air curtainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·10 claims
- 2163US11069534B2Method of manufacturing semiconductor devices and semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 2261US11322397B2Method of manufacturing semiconductor devices including formation of adhesion enhancement layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·0 cites·20 claims
- 2358US2025226322A1Interconnect layer with different dielectric regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2457US2025022925A1Methods Of Forming Contact Structure In Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2557US2025170597A1Adjustable nozzle deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2655US2022333236A1Semiconductor manufacturing apparatus with improved production yieldTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2754US10724140B2Thermal chemical vapor deposition system and operating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·0 cites·20 claims
- 2848US2025031399A1Barrier layers in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2947US10978337B2Aluminum-containing layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 3037US2013102117A1Manufacturing Processes for Field Effect Transistors Having Strain-Induced ChanelsHSU KAI-SHIUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →