Inventor · disambiguated record
Kagetaka Ichikawa
Also filed as: ICHIKAWA KAGETAKA
6 granted patents·228 citations·filing 1991–2001
87Inventor score
Files withSHOWA DENKO KK6
Top patents by PatentIndex Score
6 records- 0194US6299659B1Polishing material composition and polishing method for polishing LSI devicesSHOWA DENKO KK·Filed 2000·Granted Oct 9, 2001·66 cites·18 claims
- 0287US6478836B1Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurrySHOWA DENKO KK·Filed 2000·Granted Nov 12, 2002·38 cites·8 claims
- 0386US6410444B1Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the sameSHOWA DENKO KK·Filed 2001·Granted Jun 25, 2002·35 cites·2 claims
- 0480US6387139B1Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurrySHOWA DENKO KK·Filed 2001·Granted May 14, 2002·22 cites·4 claims
- 0576US5064589AMethod for producing high density hexagonal boron nitride sintered articleSHOWA DENKO KK·Filed 1991·Granted Nov 12, 1991·28 cites·12 claims
- 0674US6436835B1Composition for polishing a semiconductor device and process for manufacturing a semiconductor device using the sameSHOWA DENKO KK·Filed 1999·Granted Aug 20, 2002·39 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →