Inventor · disambiguated record
Kazuhiro Ikemura
Also filed as: IKEMURA KAZUHIRO
15 granted patents·2 pending applications·169 citations·filing 1992–2016
93Inventor score
Top patents by PatentIndex Score
17 records- 0191US7262514B2Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2005·Granted Aug 28, 2007·25 cites·8 claims
- 0284US7365441B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodDAINIPPON PRINTING CO LTD·Filed 2006·Granted Apr 29, 2008·15 cites·3 claims
- 0376US7064011B2Semiconductor device fabricating apparatus and semiconductor device fabricating methodNITTO DENKO CORP·Filed 2004·Granted Jun 20, 2006·21 cites·9 claims
- 0473US7501711B2Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 2005·Granted Mar 10, 2009·7 cites·3 claims
- 0565US8018044B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted Sep 13, 2011·3 cites·6 claims
- 0663US7132755B2Adhesive film for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2004·Granted Nov 7, 2006·11 cites·9 claims
- 0761US5565709ASemiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Oct 15, 1996·27 cites·5 claims
- 0853US7265167B2Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the sameNITTO DENKO CORP·Filed 2003·Granted Sep 4, 2007·2 cites·7 claims
- 0952US6248454B1Epoxy resin composition for semiconductor encapsulation and semiconductor deviceNITTO DENKO CORP·Filed 1999·Granted Jun 19, 2001·17 cites·12 claims
- 1050US5976916AMethod of producing semiconductor device and encapsulating pellet employed thereinNITTO DENKO CORP·Filed 1996·Granted Nov 2, 1999·18 cites·10 claims
- 1148US5294835AEpoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 1992·Granted Mar 15, 1994·18 cites·8 claims
- 1244US8525351B2Semiconductor device, substrate for producing semiconductor device and method of producing themIKENAGA CHIKAO·Filed 2011·Granted Sep 3, 2013·0 cites·6 claims
- 1339US7943427B2Semiconductor device, substrate for producing semiconductor device and method of producing themDAINIPPON PRINTING CO LTD·Filed 2005·Granted May 17, 2011·0 cites·3 claims
- 1439US2010193972A1Spherical sintered ferrite particles, resin composition for semiconductor encapsulation comprising them and semiconductor devices produced by using the sameNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 1537US7268191B2Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained therebyNITTO DENKO CORP·Filed 2004·Granted Sep 11, 2007·0 cites·2 claims
- 1635US2019044037A1Ceramic plate, producing method thereof, and optical semiconductor deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1733US6410615B1Semiconductor sealing epoxy resin composition and semiconductor device using the sameNITTO DENKO CORP·Filed 1999·Granted Jun 25, 2002·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →