Inventor · disambiguated record
Katsumi Inomata
Also filed as: INOMATA KATSUMI
14 granted patents·9 pending applications·102 citations·filing 1995–2016
91Inventor score
Top patents by PatentIndex Score
23 records- 0177US7015256B2Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the sameJSR CORP·Filed 2002·Granted Mar 21, 2006·20 cites·17 claims
- 0274US7214454B2Positively photosensitive insulating resin composition and cured object obtained therefromJSR CORP·Filed 2003·Granted May 8, 2007·12 cites·18 claims
- 0364US7265044B2Method for forming bump on electrode pad with use of double-layered filmJSR CORP·Filed 2003·Granted Sep 4, 2007·12 cites·13 claims
- 0462US7371500B2Positive photosensitive insulating resin composition and cured product thereofJSR CORP·Filed 2007·Granted May 13, 2008·1 cites·12 claims
- 0559US8889557B2Substrate treating method, temporary fixing composition and semiconductor deviceJSR CORP·Filed 2013·Granted Nov 18, 2014·1 cites·9 claims
- 0659US5958645ARadiation-sensitive resin compositionJAPAN SYNTHETIC RUBBER CO LTD·Filed 1997·Granted Sep 28, 1999·19 cites·21 claims
- 0751US6007961ARadiation-sensitive resin compositionJSR CORP·Filed 1997·Granted Dec 28, 1999·12 cites·20 claims
- 0851US2007248905A1Two-layer film and method of forming pattern with the sameJSR CORP·Filed 2007·Application pending·0 cites
- 0946US7247420B2Two-layer film and method of forming pattern with the sameJSR CORP·Filed 2002·Granted Jul 24, 2007·1 cites·30 claims
- 1043US10086583B2Stack, method for treating substrate material, temporary fixing composition, and semiconductor deviceJSR CORP·Filed 2014·Granted Oct 2, 2018·0 cites·5 claims
- 1143US2008097032A1Positive Photosensitive Insulating Resin Composition And Cured Product ThereofJSR CORP·Filed 2005·Application pending·0 cites
- 1241US6171750B1Radiation-sensitive resin compositionJSR CORP·Filed 1998·Granted Jan 9, 2001·10 cites·21 claims
- 1340US6048659ARadiation-sensitive resin compositionJSR CORP·Filed 1998·Granted Apr 11, 2000·6 cites·20 claims
- 1439US2006079609A1Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured productsJSR CORP·Filed 2005·Application pending·0 cites
- 1539US2007027231A1Photosensitive insulating resin composition and cured product thereofJSR CORP·Filed 2004·Application pending·0 cites
- 1636US2017127533A1Production process for solder electrode, production process for laminate, laminate and electronic partJSR CORP·Filed 2016·Application pending·0 cites
- 1735US2004110084A1Photosensitive insulating resin composition and cured product thereofJSR CORP·Filed 2002·Application pending·0 cites
- 1834US5672459ARadiation sensitive resin composition containing quinone diazide ester having two hindered phenol groupsJAPAN SYNTHETIC RUBBER CO LTD·Filed 1996·Granted Sep 30, 1997·3 cites·18 claims
- 1934US2016136638A1Microfluidic device, process for producing the same, and channel-forming photosensitive resin compositionJSR CORP·Filed 2016·Application pending·0 cites
- 2034US2007237890A1Bilayer Laminated Film for Bump Formation and Method of Bump FormationJSR CORP·Filed 2005·Application pending·0 cites
- 2131US5798201ARadiation sensitive resin compositionJAPAN SYNTHETIC RUBBER CO LTD·Filed 1997·Granted Aug 25, 1998·3 cites·12 claims
- 2229US5707558ARadiation sensitive resin compositionJAPAN SYNTHETIC RUBBER CO LTD·Filed 1995·Granted Jan 13, 1998·2 cites·7 claims
- 2327US2016049324A1Stack, method for treating substrate material, temporary fixing composition, and semiconductor deviceJSR CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →