Inventor · disambiguated record
Katsuhiro Itakura
Also filed as: ITAKURA KATSUHIRO
11 granted patents·19 pending applications·105 citations·filing 2000–2021
89Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES18ITAKURA KATSUHIRO5AWAZU TOMOYUKI3SEIKO EPSON CORP2NATSUHARA MASUHIRO1
Top patents by PatentIndex Score
30 records- 0186US7576303B2Wafer holder, and wafer prober provided therewithSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Granted Aug 18, 2009·11 cites·8 claims
- 0285US7425838B2Body for keeping a wafer and wafer prober using the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Sep 16, 2008·10 cites·21 claims
- 0383US6805808B2Method for separating chips from diamond waferSUMITOMO ELECTRIC INDUSTRIES·Filed 2001·Granted Oct 19, 2004·44 cites·6 claims
- 0472US7855569B2Wafer holder for wafer prober and wafer prober equipped with the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2005·Granted Dec 21, 2010·6 cites·44 claims
- 0570US6642813B1Surface acoustic wave device utilizing a ZnO layer and a diamond layerSUMITOMO ELECTRIC INDUSTRIES·Filed 2000·Granted Nov 4, 2003·14 cites·8 claims
- 0668US10886157B2Wafer holding unitSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jan 5, 2021·1 cites·8 claims
- 0761US6984918B1Saw deviceSEIKO EPSON CORP·Filed 2000·Granted Jan 10, 2006·8 cites·11 claims
- 0860US12033880B2Wafer holding bodySUMITOMO ELECTRIC INDUSTRIES·Filed 2020·Granted Jul 9, 2024·0 cites·20 claims
- 0957US6469416B1Surface acoustic wave deviceSUMITOMO ELECTRIC INDUSTRIES·Filed 2001·Granted Oct 22, 2002·7 cites·5 claims
- 1055US7495460B2Body for keeping a wafer, heater unit and wafer proberSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Granted Feb 24, 2009·2 cites·10 claims
- 1149US2024098847A1HeaterSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Application pending·0 cites
- 1245US2025116003A1HeaterSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Application pending·0 cites
- 1344US2007056952A1Heating unit and wafer prober having the sameITAKURA KATSUHIRO·Filed 2006·Application pending·0 cites
- 1443US2007082313A1Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unitITAKURA KATSUHIRO·Filed 2006·Application pending·0 cites
- 1543US2007045778A1Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unitITAKURA KATSUHIRO·Filed 2006·Application pending·0 cites
- 1642US6713941B2Surface acoustic wave elementSEIKO EPSON CORP·Filed 2001·Granted Mar 30, 2004·2 cites·2 claims
- 1742US2008211526A1Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer proberSHINMA KENJI·Filed 2006·Application pending·0 cites
- 1842US2007029740A1Body for keeping a wafer, method of manufacturing the same and device using the sameNATSUHARA MASUHIRO·Filed 2006·Application pending·0 cites
- 1939US2007205787A1Wafer holder, and heater unit and wafer prober provided therewithSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Application pending·0 cites
- 2039US2007182433A1Wafer holder, and wafer prober and semiconductor manufacturing apparatus provided therewithSUMITOMO ELECTRIC INDUSTRIES·Filed 2007·Application pending·0 cites
- 2138US2009045829A1Wafer holder for wafer prober and wafer prober equipped with sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Application pending·0 cites
- 2238US2007024313A1Chuck top, wafer holder having the chuck top, and wafer prober having the chuck topITAKURA KATSUHIRO·Filed 2006·Application pending·0 cites
- 2338US2007028834A1Wafer holder for wafer prober and wafer prober equipped with sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Application pending·0 cites
- 2438US2007024304A1Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer proberITAKURA KATSUHIRO·Filed 2006·Application pending·0 cites
- 2538US2007126457A1Wafer holder, and heating unit and wafer prober provided with the wafer holderSUMITOMO ELECTRIC INDUSTRIES·Filed 2006·Application pending·0 cites
- 2637US2009050621A1Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unitAWAZU TOMOYUKI·Filed 2006·Application pending·0 cites
- 2737US2011139399A1Heater unit, heating and cooling device, and apparatus comprising sameSUMITOMO ELECTRIC INDUSTRIES·Filed 2010·Application pending·0 cites
- 2836US2006057404A9Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junctionSUMITOMO ELECTRIC INDUSTRIES·Filed 2004·Application pending·0 cites
- 2932US2007046305A1Wafer holder and wafer prober having the sameAWAZU TOMOYUKI·Filed 2006·Application pending·0 cites
- 3032US2007046306A1Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unitAWAZU TOMOYUKI·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →