Inventor · disambiguated record
Kaoru Iwabuchi
Also filed as: IWABUCHI KAORU
4 granted patents·1 pending application·169 citations·filing 1996–2008
79Inventor score
Files withSONY CORP4
Top patents by PatentIndex Score
5 records- 0186US6008543AConductive bumps on pads for flip chip applicationSONY CORP·Filed 1996·Granted Dec 28, 1999·109 cites·5 claims
- 0267US6030890AMethod of manufacturing a semiconductor deviceSONY CORP·Filed 1997·Granted Feb 29, 2000·36 cites·1 claims
- 0360US7860390B2Imaging element package, imaging element module and lens barrel, and image capturing apparatusSONY CORP·Filed 2008·Granted Dec 28, 2010·1 cites·20 claims
- 0455US6434017B1Semiconductor device and electronic apparatusSONY CORP·Filed 1999·Granted Aug 13, 2002·23 cites·10 claims
- 0532US2003011077A1Sealing resin for flip-flop mountingFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →