Inventor · disambiguated record
Kai Jen
Also filed as: JEN KAI
20 granted patents·7 pending applications·17 citations·filing 2018–2024
89Inventor score
Files withWINBOND ELECTRONICS CORP27
Top patents by PatentIndex Score
27 records- 0194US10083906B1Memory device with buried word line for reduced gate-induced drain leakage current and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Sep 25, 2018·11 cites·20 claims
- 0286US11430792B2Dynamic random-access memoryWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 30, 2022·2 cites·13 claims
- 0376US2025098156A1Method for forming semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0470US12310000B2Manufacturing method of semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 0570US11765888B2Methods of manufacturing dynamic random access memoryWINBOND ELECTRONICS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·7 claims
- 0670US11183499B2Dynamic random access memory and methods of manufacturing, writing and reading the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Nov 23, 2021·2 cites·8 claims
- 0769US12089394B2Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Sep 10, 2024·0 cites·9 claims
- 0868US11101179B2Semiconductor structure with protection portions and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Aug 24, 2021·1 cites·16 claims
- 0967US12193221B2Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jan 7, 2025·0 cites·10 claims
- 1067US11923449B2Manufacturing method for semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 1167US2024312791A1Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1265US11495605B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 8, 2022·0 cites·9 claims
- 1363US11665879B2Method of manufacturing dynamic random-access memoryWINBOND ELECTRONICS CORP·Filed 2022·Granted May 30, 2023·0 cites·17 claims
- 1461US10998320B2Memory structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 4, 2021·1 cites·16 claims
- 1560US2024332418A1Semiconductor device and method forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1659US12016173B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 18, 2024·0 cites·14 claims
- 1759US11943913B2Method of manufacturing semiconductor structure having multi-work function gate electrodeWINBOND ELECTRONICS CORP·Filed 2023·Granted Mar 26, 2024·0 cites·15 claims
- 1858US12020945B2Dynamic random access memory and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 25, 2024·0 cites·15 claims
- 1958US11367787B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Granted Jun 21, 2022·0 cites·13 claims
- 2052US11784087B2Semiconductor structure having layers in a trench and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
- 2151US2023084548A1Semiconductor structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2021·Application pending·0 cites
- 2250US2024315000A1Memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2349US12107162B2Multi-gate semiconductor structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Oct 1, 2024·0 cites·18 claims
- 2446US11018140B2Semiconductor device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 2543US2024186396A1Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 2641US10998323B2Dynamic random access memoryWINBOND ELECTRONICS CORP·Filed 2019·Granted May 4, 2021·0 cites·10 claims
- 2730US2020185495A1Semiconductor devices and methods for forming sameWINBOND ELECTRONICS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →