Inventor · disambiguated record
Kangsub Jeong
Also filed as: JEONG KANGSUB
1 granted patent·2 pending applications·0 citations·filing 2023–2024
4Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0153US2025140751A1Semiconductor memory device with stacked chips structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0244US12469543B2Memory core circuits having cell-on-periphery structures and memory devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 0344US2025149080A1Memory device for controlling shielding bit linesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →