Inventor · disambiguated record
Katsumi Kakamu
Also filed as: KAKAMU KATSUMI
17 granted patents·4 pending applications·78 citations·filing 1999–2019
91Inventor score
Top patents by PatentIndex Score
21 records- 0187US10944042B2Piezoelectric actuator and method for manufacturing piezoelectric actuatorBROTHER IND LTD·Filed 2018·Granted Mar 9, 2021·2 cites·18 claims
- 0277US6885105B2Semiconductor device with copper wiringsFUJITSU LTD·Filed 2002·Granted Apr 26, 2005·20 cites·14 claims
- 0371US6777323B2Lamination structure with copper wiring and its manufacture methodFUJITSU LTD·Filed 2002·Granted Aug 17, 2004·14 cites·11 claims
- 0467US6794693B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2003·Granted Sep 21, 2004·9 cites·6 claims
- 0565US7030498B2Semiconductor device with copper wirings having improved negative bias temperature instability (NBTI)FUJITSU LTD·Filed 2004·Granted Apr 18, 2006·10 cites·10 claims
- 0662US11130336B2Liquid ejection headBROTHER IND LTD·Filed 2019·Granted Sep 28, 2021·0 cites·19 claims
- 0759US6211570B1Semiconductor device having a multilayer interconnection structureFUJITSU LTD·Filed 1999·Granted Apr 3, 2001·20 cites·7 claims
- 0858US9610771B2Liquid discharge apparatus and method for producing the sameBROTHER IND LTD·Filed 2015·Granted Apr 4, 2017·0 cites·16 claims
- 0954US2009149031A1Method of making a semiconductor device with residual amine group free multilayer interconnectionFUJITSU LTD·Filed 2008·Application pending·0 cites
- 1051US10377138B2Method for producing liquid discharge apparatusBROTHER IND LTD·Filed 2017·Granted Aug 13, 2019·0 cites·3 claims
- 1149US6455444B2Semiconductor device having a multilayer interconnection structureFUJITSU LTD·Filed 2001·Granted Sep 24, 2002·2 cites·5 claims
- 1248US10864735B2Liquid ejection headBROTHER IND LTD·Filed 2019·Granted Dec 15, 2020·0 cites·14 claims
- 1347US10960668B2Liquid discharge head and liquid discharge apparatusBROTHER IND LTD·Filed 2019·Granted Mar 30, 2021·0 cites·21 claims
- 1446US11155088B2Liquid ejection headBROTHER IND LTD·Filed 2019·Granted Oct 26, 2021·0 cites·17 claims
- 1546US10857796B2Liquid ejection head and liquid ejection deviceBROTHER IND LTD·Filed 2019·Granted Dec 8, 2020·0 cites·18 claims
- 1646US10205086B2Piezoelectric actuator and method for manufacturing piezoelectric actuatorBROTHER IND LTD·Filed 2015·Granted Feb 12, 2019·0 cites·18 claims
- 1746US6878619B2Method for fabricating semiconductor deviceFUJITSU LTD·Filed 2003·Granted Apr 12, 2005·1 cites·17 claims
- 1843US2005012122A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2004·Application pending·0 cites
- 1941US2003227087A1Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2003·Application pending·0 cites
- 2038US9340025B2Method for producing liquid discharge apparatus, liquid discharge apparatus, and method for forming liquid repellent layerBROTHER IND LTD·Filed 2015·Granted May 17, 2016·0 cites·6 claims
- 2136US2003068582A1Method of manufacturing semiconductor device having silicon carbide filmFUJITSU LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →