Inventor · disambiguated record
Katsuhiko Kamiya
Also filed as: KAMIYA KATSUHIKO
10 granted patents·22 pending applications·42 citations·filing 2003–2016
86Inventor score
Top patents by PatentIndex Score
32 records- 0187US10836937B2Pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2016·Granted Nov 17, 2020·2 cites·15 claims
- 0284US9650547B2Radiation-curable pressure-sensitive adhesive, radiation-curable pressure-sensitive adhesive layer, radiation-curable pressure-sensitive adhesive sheet, and laminateNITTO DENKO CORP·Filed 2013·Granted May 16, 2017·4 cites·13 claims
- 0378US8119236B2Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Granted Feb 21, 2012·8 cites·10 claims
- 0475US7491772B2Removable water-dispersible acrylic adhesive composition and adhesive sheetNITTO DENKO CORP·Filed 2006·Granted Feb 17, 2009·5 cites·13 claims
- 0572US9657197B2Adhesive, adhesive layer, and adhesive sheetHIGASHI MASATSUGU·Filed 2012·Granted May 23, 2017·1 cites·16 claims
- 0670US7160611B2Pressure sensitive adhesive optical film and image viewing displayNITTO DENKO CORP·Filed 2003·Granted Jan 9, 2007·14 cites·5 claims
- 0769US8617928B2Dicing/die bonding filmKAMIYA KATSUHIKO·Filed 2008·Granted Dec 31, 2013·4 cites·12 claims
- 0864US9527944B2Pressure-sensitive adhesive layer for transparent conductive film, transparent conductive film with pressure-sensitive adhesive layer, transparent conductive laminate, and touch panelNITTO DENKO CORP·Filed 2012·Granted Dec 27, 2016·1 cites·14 claims
- 0963US7880316B2Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Granted Feb 1, 2011·3 cites·5 claims
- 1056US2014039128A1Radiation-curable pressure-sensitive adhesive layer, and radiation-curable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1153US2017002235A1Adhesive, adhesive layer, and adhesive sheetNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1253US2013251990A1Pressure-sensitive adhesive, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1347US2010029059A1Dicing die-bonding filmMATSUMURA TAKESHI·Filed 2009·Application pending·0 cites
- 1447US2010129989A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1547US2010129987A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1647US2010129986A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1746US2013273361A1Active Energy Ray-Curable Pressure-Sensitive Adhesive for Re-Release and Dicing Die-Bonding FilmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1846US2010239866A1Dicing die-bonding filmNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1946US2009209089A1Dicing die-bonding filmMURATA SHUUHEI·Filed 2009·Application pending·0 cites
- 2046US2011053346A1Dicing/die bonding filmNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 2145US2012277368A1Aqueous dispersion pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetKOSO MASATSUGU·Filed 2012·Application pending·0 cites
- 2244US2014272201A1Pressure-sensitive adhesive, pressure sensitive adhesive layer, pressure-sensitive adhesive sheet, and touch panelNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2344US2010028687A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Application pending·0 cites
- 2444US2010029061A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2009·Application pending·0 cites
- 2544US2010233409A1Dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2008·Application pending·0 cites
- 2644US2010129988A1Dicing die-bonding film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2744US2015010754A1Pressure-sensitive adhesive, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 2843US11772343B2Functionalized laminated optical element with improved edging resistanceESSILOR INT·Filed 2016·Granted Oct 3, 2023·0 cites·19 claims
- 2940US2012003470A1Active energy ray-curable pressure-sensitive adhesive for re-release and dicing die-bonding filmKAMIYA KATSUHIKO·Filed 2011·Application pending·0 cites
- 3033US2010279109A1Laminated film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3133US2010279050A1Laminated film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3233US2010279468A1Laminated film and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →