Inventor · disambiguated record
Kazunobu Kamiya
Also filed as: KAMIYA KAZUNOBU
19 granted patents·5 pending applications·39 citations·filing 2003–2022
91Inventor score
Files withDEXERIALS CORP11KAMIYA KAZUNOBU8SONY CHEM & INF DEVICE CORP2SONY CORP2SONY CHEMICALS & INFORMATION D1
Top patents by PatentIndex Score
24 records- 0191US8198342B2Aluminum chelate latent curing agent and production method thereofKAMIYA KAZUNOBU·Filed 2010·Granted Jun 12, 2012·9 cites·8 claims
- 0290US10669458B2Thermosetting epoxy resin composition and production method for sameDEXERIALS CORP·Filed 2017·Granted Jun 2, 2020·2 cites·8 claims
- 0386US10626215B2Process for producing aluminum-chelate-based latent curing agent, and thermosetting epoxy resin compositionDEXERIALS CORP·Filed 2016·Granted Apr 21, 2020·2 cites·15 claims
- 0486US8349973B2Thermosetting epoxy resin compositionSONY CHEM & INF DEVICE CORP·Filed 2008·Granted Jan 8, 2013·6 cites·8 claims
- 0579US8039522B2Latent curing agentSONY CORP·Filed 2005·Granted Oct 18, 2011·4 cites·7 claims
- 0678US10093769B2Aluminum chelate-based latent curing agent, method of producing same, and thermosetting epoxy resinDEXERIALS CORP·Filed 2015·Granted Oct 9, 2018·1 cites·14 claims
- 0775US8686108B2Aluminum chelate latent curing agent and production method thereofKAMIYA KAZUNOBU·Filed 2010·Granted Apr 1, 2014·2 cites·12 claims
- 0872US8927626B2Latent curing agentKAMIYA KAZUNOBU·Filed 2008·Granted Jan 6, 2015·2 cites·15 claims
- 0969US7851520B2Thermosetting epoxy resin compositionSONY CORP·Filed 2006·Granted Dec 14, 2010·4 cites·10 claims
- 1068US11795264B2Latent curing agent and method for manufacturing same, composition for forming coating film, and cation-curable compositionDEXERIALS CORP·Filed 2020·Granted Oct 24, 2023·0 cites·9 claims
- 1168US2025011582A1Latent curing agent, production method therefor, and curable compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1265US2023279217A1Cationic curing agent, method for producing same and cationically curable compositionDEXERIALS CORP·Filed 2022·Application pending·0 cites
- 1365US2024026149A1Curing agent, method of producing curing agent, and curable compositionDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 1464US10745551B2Latent curing agent, production method therefor, and thermosetting epoxy resin compositionDEXERIALS CORP·Filed 2017·Granted Aug 18, 2020·0 cites·9 claims
- 1563US12240942B2Cationic curing agent, method for producing same and cationically curable compositionDEXERIALS CORP·Filed 2020·Granted Mar 4, 2025·0 cites·16 claims
- 1659US7524559B2Resin particle, conductive particle, and anisotropic conductive adhesive containing the sameSONY CHEM & INF DEVICE CORP·Filed 2007·Granted Apr 28, 2009·0 cites·3 claims
- 1758US7338710B2Resin particle, conductive particle and anisotropic conductive adhesive containing the sameSONY CHEMICALS & INFORMATION D·Filed 2003·Granted Mar 4, 2008·7 cites·13 claims
- 1854US11773208B2Cationically curable composition and cured product production methodDEXERIALS CORP·Filed 2019·Granted Oct 3, 2023·0 cites·11 claims
- 1954US8871347B2Microcapsule-type latent curing agentKAMIYA KAZUNOBU·Filed 2008·Granted Oct 28, 2014·0 cites·10 claims
- 2054US8835572B2Aluminum chelate latent curing agentKAMIYA KAZUNOBU·Filed 2011·Granted Sep 16, 2014·0 cites·15 claims
- 2150US9481787B2Method for producing latent curing agentKAMIYA KAZUNOBU·Filed 2011·Granted Nov 1, 2016·0 cites·13 claims
- 2249US2019194454A1Compound, Cationic Curing Agent, and Cationic Curable CompositionDEXERIALS CORP·Filed 2018·Application pending·0 cites
- 2346US9459197B2Method for measuring dynamic viscoelasticity of particulate materialKAMIYA KAZUNOBU·Filed 2012·Granted Oct 4, 2016·0 cites·8 claims
- 2441US2007010636A1Latent hardenerKAMIYA KAZUNOBU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →