Inventor · disambiguated record
Kaoru Katayama
Also filed as: KATAYAMA KAORU
26 granted patents·3 pending applications·374 citations·filing 1985–2008
96Inventor score
Top patents by PatentIndex Score
29 records- 0187US8284350B2Lighting system and liquid crystal display using the sameABE MAKOTO·Filed 2008·Granted Oct 9, 2012·11 cites·16 claims
- 0283US6435401B1Apparatus and a method for removing solder from an objectHITACHI LTD·Filed 2000·Granted Aug 20, 2002·31 cites·14 claims
- 0382US7329855B2Optical inspection of glass bottles using multiple camerasKIRIN TECHNO SYSTEM CORP·Filed 2002·Granted Feb 12, 2008·28 cites·9 claims
- 0478US5832595AMethod of modifying conductive lines of an electronic circuit board and its apparatusHITACHI LTD·Filed 1994·Granted Nov 10, 1998·58 cites·7 claims
- 0575US7330251B2Method and apparatus for producing reference image in glass bottle inspecting apparatusKIRIN TECHNO SYSTEM CORP·Filed 2002·Granted Feb 12, 2008·14 cites·12 claims
- 0675US5801350ASurface reformation method of high polymer materialHITACHI LTD·Filed 1996·Granted Sep 1, 1998·39 cites·19 claims
- 0775US4573808APneumatic journal bearingNISSAN MOTOR·Filed 1985·Granted Mar 4, 1986·31 cites·5 claims
- 0872US5499668AProcess for making electronic deviceHITACHI LTD·Filed 1994·Granted Mar 19, 1996·43 cites·10 claims
- 0966US6269998B1Process for manufacturing electronic circuitsHITACHI LTD·Filed 2000·Granted Aug 7, 2001·9 cites·8 claims
- 1066US5229569ALaser machining apparatus and method of the sameHITACHI LTD·Filed 1991·Granted Jul 20, 1993·24 cites·26 claims
- 1160US6457228B1Method for sealing liquid coolant into moduleHITACHI LTD·Filed 2000·Granted Oct 1, 2002·16 cites·18 claims
- 1260US6161748AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 2000·Granted Dec 19, 2000·6 cites·5 claims
- 1358US6739045B2Method for removing solder bumps from LSIHITACHI LTD·Filed 2002·Granted May 25, 2004·7 cites·20 claims
- 1457US6433810B1Laser printing method and apparatus for printing charactersHITACHI LTD·Filed 2000·Granted Aug 13, 2002·1 cites·18 claims
- 1557US5940728AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 1996·Granted Aug 17, 1999·15 cites·21 claims
- 1655US2009014504A1Method of Supplying Paste Solder Material and Metal Mask ThereforHITACHI LTD·Filed 2008·Application pending·0 cites
- 1749US6795105B2Laser printing method and apparatusHITACHI LTD·Filed 2002·Granted Sep 21, 2004·0 cites·28 claims
- 1849US2006006213A1Method of supplying paste solder material and metal mask thereforHITACHI LTD·Filed 2005·Application pending·0 cites
- 1947US6325270B1Solder removing apparatusHITACHI LTD·Filed 2000·Granted Dec 4, 2001·2 cites·16 claims
- 2046US6410881B2Process for manufacturing electronic circuitsHITACHI LTD·Filed 2001·Granted Jun 25, 2002·1 cites·12 claims
- 2144US5262614ACircuit board and sealing structure and methods for manufacturing the sameHITACHI LTD·Filed 1991·Granted Nov 16, 1993·14 cites·16 claims
- 2243US7401393B2Method for removing solder bumps from LSIHITACHI LTD·Filed 2004·Granted Jul 22, 2008·1 cites·19 claims
- 2342US7941343B1Method and system for enhancing product sales in network transactionsRICOH CO LTD·Filed 2001·Granted May 10, 2011·0 cites·19 claims
- 2440US6281575B1Multi-chip moduleHITACHI LTD·Filed 1999·Granted Aug 28, 2001·9 cites·9 claims
- 2540US2009096957A1Liquid Crystal Display DeviceHIYAMA IKUO·Filed 2008·Application pending·0 cites
- 2639US6133135AProcess for manufacturing electronic circuitsHITACHI LTD·Filed 1999·Granted Oct 17, 2000·5 cites·8 claims
- 2736US5023407APrinted circuit board with a uniform conductive layer formed by equalization of metals thereinHITACHI LTD·Filed 1989·Granted Jun 11, 1991·6 cites·16 claims
- 2832US6423405B1Surface reformation method of high polymer materialHITACHI LTD·Filed 1999·Granted Jul 23, 2002·2 cites·8 claims
- 2930US6017424ALaser assisted surface reformation method of high polymer materialHITACHI LTD·Filed 1998·Granted Jan 25, 2000·1 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →