Inventor · disambiguated record
Kaoru Katoh
Also filed as: KATOH KAORU
8 granted patents·8 pending applications·20 citations·filing 2002–2012
78Inventor score
Files withSHINETSU CHEMICAL CO6ASANO MASATOSHI2KATOH KAORU2HITACHI LTD1NAT INST OF ADVANCED IND SCIEN1
Top patents by PatentIndex Score
16 records- 0184US8159282B2Semiconductor integrated circuit and high frequency module with the sameKATOH KAORU·Filed 2009·Granted Apr 17, 2012·13 cites·18 claims
- 0260US7169833B2Liquid epoxy resin composition and semiconductor deviceSHIN ESTU CHEMICAL CO LTD·Filed 2004·Granted Jan 30, 2007·6 cites·3 claims
- 0359US2010016474A1Liquid epoxy resin compositionASANO MASATOSHI·Filed 2009·Application pending·0 cites
- 0454US7829381B2Method of manufacturing a semiconductor deviceSHINETSU CHEMICAL CO·Filed 2008·Granted Nov 9, 2010·1 cites·6 claims
- 0554US2007104959A1Liquid epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 0647US2010001415A1Liquid epoxy resin compositionASANO MASATOSHI·Filed 2009·Application pending·0 cites
- 0746US7642661B2Liquid epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2006·Granted Jan 5, 2010·0 cites·7 claims
- 0844US2007104960A1Liquid epoxy resin compositionSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 0943US8330524B2Semiconductor integrated circuit and high frequency module with the sameKATOH KAORU·Filed 2012·Granted Dec 11, 2012·0 cites·18 claims
- 1043US6838175B2Carbon microrod and method of producing the sameNAT INST OF ADVANCED IND SCIEN·Filed 2002·Granted Jan 4, 2005·0 cites·6 claims
- 1141US2007134844A1Process for producing flip-chip type semiconductor device and semiconductor device produced by the processSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 1240US2008070054A1Set of resin compositions for preparing system-in-package type semiconductor deviceSHINETSU CHEMICAL CO·Filed 2007·Application pending·0 cites
- 1338US9018281B2Set of resin compositions for preparing system-in-package type semiconductor deviceSUMITA KAZUAKI·Filed 2011·Granted Apr 28, 2015·0 cites·5 claims
- 1438US2014334214A1Inverter DeviceHITACHI LTD·Filed 2012·Application pending·0 cites
- 1537US2011221519A1Semiconductor integrated circuit and high frequency module using the sameRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 1635US8163556B2Method of cell culture observation, carbon substrate for cell culture observation, and method for manufacture thereofSUDA YOSHIHISA·Filed 2006·Granted Apr 24, 2012·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →