Inventor · disambiguated record
Kazushige Kawasaki
Also filed as: KAWASAKI KAZUSHIGE
49 granted patents·13 pending applications·210 citations·filing 2000–2025
97Inventor score
Top patents by PatentIndex Score
62 records- 0198US9396998B2Semiconductor device having fan-in and fan-out redistribution layersTOSHIBA KK·Filed 2014·Granted Jul 19, 2016·62 cites·21 claims
- 0293US10892269B2Semiconductor memory device having a bonded circuit chip including a solid state drive controller connected to a control circuitTOSHIBA MEMORY CORP·Filed 2019·Granted Jan 12, 2021·6 cites·15 claims
- 0393US10128223B2Semiconductor device and manufacturing method thereofTOSHIBA MEMORY CORP·Filed 2017·Granted Nov 13, 2018·8 cites·18 claims
- 0492US2025393215A1Semiconductor memory deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 0590US6606334B1Semiconductor laserMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Aug 12, 2003·34 cites·20 claims
- 0688US7456039B1Method for manufacturing semiconductor optical deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Nov 25, 2008·11 cites·3 claims
- 0787US10497688B2Semiconductor device having stacked logic and memory chipsTOSHIBA MEMORY CORP·Filed 2018·Granted Dec 3, 2019·5 cites·19 claims
- 0885US12419055B2Semiconductor memory device having a circuit chip bonded to a memory array chip and including a solid-state drive controller and a control circuitKIOXIA CORP·Filed 2023·Granted Sep 16, 2025·0 cites·2 claims
- 0985US10811393B2Memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 20, 2020·3 cites·13 claims
- 1083US8209856B2Printed wiring board and method for manufacturing the sameMORI HIROYUKI·Filed 2009·Granted Jul 3, 2012·10 cites·3 claims
- 1182US8373276B2Printed wiring board and method for manufacturing the sameIBM·Filed 2012·Granted Feb 12, 2013·4 cites·5 claims
- 1279US7751456B2Method for manufacturing semiconductor optical deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Jul 6, 2010·6 cites·6 claims
- 1378US9455550B2Distributed feedback laser diodeMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 27, 2016·2 cites·4 claims
- 1473US7981704B2Method for manufacturing semiconductor optical deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Jul 19, 2011·4 cites·10 claims
- 1572US11871576B2Semiconductor memory device including integrated control circuit and solid-state drive controllerKIOXIA CORP·Filed 2020·Granted Jan 9, 2024·0 cites·15 claims
- 1672US7687391B2Electrically optimized and structurally protected via structure for high speed signalsIBM·Filed 2006·Granted Mar 30, 2010·5 cites·12 claims
- 1771US10510725B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Granted Dec 17, 2019·1 cites·16 claims
- 1871US9721935B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2014·Granted Aug 1, 2017·2 cites·44 claims
- 1971US7582908B2Nitride semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Sep 1, 2009·3 cites·17 claims
- 2069US11270981B2Memory deviceKIOXIA CORP·Filed 2020·Granted Mar 8, 2022·0 cites·17 claims
- 2168US6697406B2Semiconductor device and photonic semiconductor device applying the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Feb 24, 2004·11 cites·12 claims
- 2266US7964424B2Method for manufacturing nitride semiconductor light-emitting elementMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Jun 21, 2011·2 cites·19 claims
- 2366US6946684B2Optical semiconductor device with low reflectance coatingMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Sep 20, 2005·15 cites·20 claims
- 2464US7289546B1Semiconductor laser having an improved stacked structureMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Oct 30, 2007·2 cites·7 claims
- 2564US7259406B2Semiconductor optical elementMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Aug 21, 2007·2 cites·4 claims
- 2661US8163576B2Nitride semiconductor device having a silicon-containing layer and manufacturing method thereofSHIOZAWA KATSUOMI·Filed 2009·Granted Apr 24, 2012·2 cites·10 claims
- 2759US12489086B2Semiconductor deviceKIOXIA CORP·Filed 2022·Granted Dec 2, 2025·0 cites·11 claims
- 2858US2025038474A1Optical semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2955US6804282B2Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Oct 12, 2004·4 cites·7 claims
- 3054US7901966B2Method for manufacturing nitride semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2009·Granted Mar 8, 2011·0 cites·8 claims
- 3153US11568901B2Semiconductor deviceKIOXIA CORP·Filed 2021·Granted Jan 31, 2023·0 cites·15 claims
- 3253US6919635B2High density microvia substrate with high wireabilityIBM·Filed 2003·Granted Jul 19, 2005·4 cites·30 claims
- 3352US7683398B2Nitride semiconductor device having a silicon-containing connection layer and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Mar 23, 2010·0 cites·3 claims
- 3452US2015207295A1Distributed feedback laser diode and distributed feedback laser diode fabrication methodMITSUBISHI ELECTRIC CORP·Filed 2014·Application pending·0 cites
- 3551US10784648B2Semiconductor laser with waveguide flanked by conductive layersMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 22, 2020·0 cites·10 claims
- 3651US7911049B2Electrically optimized and structurally protected via structure for high speed signalsIBM·Filed 2008·Granted Mar 22, 2011·0 cites·12 claims
- 3751US7691655B2Method of manufacturing semiconductor optical deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Apr 6, 2010·0 cites·6 claims
- 3849US7897418B2Method for manufacturing semiconductor light emitting deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Mar 1, 2011·0 cites·20 claims
- 3948US7791097B2Nitride semiconductor device and manufacturing method of the sameMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Sep 7, 2010·0 cites·10 claims
- 4047US10186487B2Semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Jan 22, 2019·0 cites·11 claims
- 4146US7714439B2Nitride semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2007·Granted May 11, 2010·0 cites·6 claims
- 4246US6907057B2Semiconductor optical device and semiconductor laser module using the semiconductor optical deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Jun 14, 2005·2 cites·10 claims
- 4346US2009184336A1Semiconductor light emitting device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 4446US2009127661A1Nitride semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 4545US7842962B2Nitride semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Nov 30, 2010·0 cites·4 claims
- 4645US7577173B2Semiconductor laser device having a low reflection film of stable reflectanceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Aug 18, 2009·0 cites·4 claims
- 4744US10777529B2Semiconductor device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 4844US7656920B2Semiconductor laser deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted Feb 2, 2010·0 cites·8 claims
- 4944US2015069596A1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 5043US7378351B2Method of manufacturing nitride semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Granted May 27, 2008·0 cites·4 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →