Inventor · disambiguated record
Kazuya Kiguchi
Also filed as: KIGUCHI KAZUYA
4 granted patents·7 pending applications·2 citations·filing 2016–2025
58Inventor score
Top patents by PatentIndex Score
11 records- 0185US10988585B2Resin sheet and cured product of resin sheetHITACHI CHEMICAL CO LTD·Filed 2016·Granted Apr 27, 2021·2 cites·10 claims
- 0271US10851200B2Resin composition and method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·6 claims
- 0368US2025197557A1Epoxy resin b-stage film, epoxy resin cured film and method of producing epoxy resin cured filmRESONAC CORP·Filed 2025·Application pending·0 cites
- 0464US10590232B2Resin composition and method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·10 claims
- 0561US2022025107A1Epoxy resin b-stage film, epoxy resin cured film and method of producing epoxy resin cured filmSHOWA DENKO MATERIALS CO LTD·Filed 2018·Application pending·0 cites
- 0651US2024400825A1Resin composition, cured product thereof, laminate using same, electrostatic chuck, and plasma processing equipmentTORAY INDUSTRIES·Filed 2022·Application pending·0 cites
- 0748US2024034882A1Resin composition, sheet-form composition, sheet cured product, laminate, laminate member, wafer holder, and semiconductor manufacturing deviceTORAY INDUSTRIES·Filed 2021·Application pending·0 cites
- 0845US2020324538A1Method of producing laminateHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0936US11795293B2Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 24, 2023·0 cites·14 claims
- 1035US2020163221A1Circuit board production method, circuit sheet and circuit boardHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1135US2021206906A1Resin composition, resin member, resin sheet, b-stage sheet, c-stage sheet, metal foil with resin, metal substrate, and power semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2018·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kazuya Kiguchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →