Inventor · disambiguated record
Katsumi Kikuchi
Also filed as: KIKUCHI KATSUMI
84 granted patents·48 pending applications·1,076 citations·filing 1989–2025
99Inventor score
Top patents by PatentIndex Score
132 records- 0198US7338884B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2004·Granted Mar 4, 2008·286 cites·17 claims
- 0297US7397000B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2005·Granted Jul 8, 2008·54 cites·18 claims
- 0396US8004074B2Semiconductor device and fabrication methodNEC CORP·Filed 2008·Granted Aug 23, 2011·53 cites·14 claims
- 0495USD784618SElectric hair clipperPANASONIC IP MAN CO LTD·Filed 2015·Granted Apr 18, 2017·64 cites·1 claims
- 0595US8569892B2Semiconductor device and manufacturing method thereofMORI KENTARO·Filed 2009·Granted Oct 29, 2013·41 cites·9 claims
- 0692US8039756B2Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Oct 18, 2011·20 cites·15 claims
- 0792US7294393B2Sheet material and wiring boardNEC CORP·Filed 2005·Granted Nov 13, 2007·22 cites·23 claims
- 0892US6861757B2Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor deviceNEC CORP·Filed 2002·Granted Mar 1, 2005·55 cites·46 claims
- 0991US12010371B2Information processing apparatus, video distribution system, information processing method, and recording mediumNEC CORP·Filed 2020·Granted Jun 11, 2024·4 cites·10 claims
- 1091US7566834B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2008·Granted Jul 28, 2009·17 cites·11 claims
- 1190US8072073B2Semiconductor device and method of manufacturing sameKIKUCHI KATSUMI·Filed 2008·Granted Dec 6, 2011·23 cites·19 claims
- 1290US7791186B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2006·Granted Sep 7, 2010·17 cites·32 claims
- 1389US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 1488US8710639B2Semiconductor element-embedded wiring substrateKIKUCHI KATSUMI·Filed 2011·Granted Apr 29, 2014·11 cites·21 claims
- 1587US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 1687US6841862B2Semiconductor package board using a metal baseNEC CORP·Filed 2001·Granted Jan 11, 2005·33 cites·25 claims
- 1785US10737580B2VehicleSUBARU CORP·Filed 2018·Granted Aug 11, 2020·5 cites·18 claims
- 1885US8766440B2Wiring board with built-in semiconductor elementKIKUCHI KATSUMI·Filed 2011·Granted Jul 1, 2014·9 cites·29 claims
- 1985US6278153B1Thin film capacitor formed in viaNEC CORP·Filed 1999·Granted Aug 21, 2001·62 cites·30 claims
- 2084USD717996SElectric shaverPANASONIC CORP·Filed 2014·Granted Nov 18, 2014·28 cites·1 claims
- 2184US7880295B2Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the sameNEC CORP·Filed 2009·Granted Feb 1, 2011·9 cites·6 claims
- 2284US7696007B2Semiconductor package board using a metal baseNEC CORP·Filed 2009·Granted Apr 13, 2010·8 cites·21 claims
- 2384US7348673B2Semiconductor deviceNEC CORP·Filed 2005·Granted Mar 25, 2008·13 cites·34 claims
- 2483USD784619SElectric hair clipperPANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 18, 2017·21 cites·1 claims
- 2583US7649749B2Wiring substrate, semiconductor device, and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Granted Jan 19, 2010·10 cites·26 claims
- 2683US7233066B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2006·Granted Jun 19, 2007·8 cites·7 claims
- 2780US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 2880US7060604B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2003·Granted Jun 13, 2006·21 cites·32 claims
- 2979US7474538B2Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor packageNEC CORP·Filed 2004·Granted Jan 6, 2009·22 cites·38 claims
- 3077US12300079B2Processing system, processing method, and non-transitory storage mediumNEC CORP·Filed 2024·Granted May 13, 2025·0 cites·11 claims
- 3174US6299208B1Occupant protection structureFUJI HEAVY IND LTD·Filed 1999·Granted Oct 9, 2001·48 cites·5 claims
- 3272US8929090B2Functional element built-in substrate and wiring substrateNAKASHIMA YOSHIKI·Filed 2011·Granted Jan 6, 2015·4 cites·19 claims
- 3372US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 3472USD492254SWire duct plugMATSUSHITA ELECTRIC WORKS LTD·Filed 2002·Granted Jun 29, 2004·17 cites·1 claims
- 3570USD718900SElectric shaverPANASONIC CORP·Filed 2014·Granted Dec 2, 2014·15 cites·1 claims
- 3670US8810008B2Semiconductor element-embedded substrate, and method of manufacturing the substrateMORI KENTARO·Filed 2011·Granted Aug 19, 2014·3 cites·29 claims
- 3770US8004085B2Semiconductor device and method of manufacturing semiconductor deviceNEC CORP·Filed 2008·Granted Aug 23, 2011·4 cites·10 claims
- 3869US8050050B2Wiring board, semiconductor device, and method of manufacturing the sameNEC CORP·Filed 2010·Granted Nov 1, 2011·2 cites·12 claims
- 3967US8552570B2Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor deviceKIKUCHI KATSUMI·Filed 2009·Granted Oct 8, 2013·3 cites·13 claims
- 4067US8536691B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2007·Granted Sep 17, 2013·4 cites·25 claims
- 4167US2025299487A1Video processing device, video processing method, and recording mediumNEC CORP·Filed 2025·Application pending·0 cites
- 4266US8692364B2Semiconductor device and method for manufacturing the sameKIKUCHI KATSUMI·Filed 2010·Granted Apr 8, 2014·2 cites·20 claims
- 4366US7585699B2Semiconductor package board using a metal baseNEC CORP·Filed 2006·Granted Sep 8, 2009·2 cites·19 claims
- 4465US8148816B2Semiconductor deviceSASAKI HIDEKI·Filed 2008·Granted Apr 3, 2012·4 cites·15 claims
- 4564US11935373B2Processing system, processing method, and non-transitory storage mediumNEC CORP·Filed 2020·Granted Mar 19, 2024·0 cites·9 claims
- 4664US10942035B2VehicleSUBARU CORP·Filed 2018·Granted Mar 9, 2021·2 cites·20 claims
- 4764US2025204278A1Superconducting device and method for manufacturing the sameNEC CORP·Filed 2024·Application pending·0 cites
- 4863US7784653B2Discharge device and discharge methodNICHICON CORP·Filed 2005·Granted Aug 31, 2010·1 cites·1 claims
- 4963US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 5062US12488589B2Video processing device, video processing method, training device, training method, and recording mediumNEC CORP·Filed 2020·Granted Dec 2, 2025·0 cites·9 claims
Showing the top 50 of 132 patent records by PatentIndex Score.
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