Inventor · disambiguated record
Kang Hun Kim
Also filed as: KIM KANG HUN
4 granted patents·3 pending applications·0 citations·filing 2021–2023
52Inventor score
Technology areasH10W
Files withSK HYNIX INC7
Top patents by PatentIndex Score
7 records- 0157US12237251B2Semiconductor package including connection pad including groove patternSK HYNIX INC·Filed 2022·Granted Feb 25, 2025·0 cites·19 claims
- 0255US12002783B2Methods of manufacturing semiconductor device with bump interconnectionSK HYNIX INC·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 0353US2024162176A1Semiconductor package including bump interconnection structureSK HYNIX INC·Filed 2023·Application pending·0 cites
- 0452US12288761B2Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the sameSK HYNIX INC·Filed 2022·Granted Apr 29, 2025·0 cites·20 claims
- 0551US12451467B2Semiconductor device having a redistribution bonding interconnection, a method of manufacturing the semiconductor device, and a chip stack package including the semiconductor deviceSK HYNIX INC·Filed 2022·Granted Oct 21, 2025·0 cites·11 claims
- 0648US2023154879A1Semiconductor device, a package substrate, and a semiconductor packageSK HYNIX INC·Filed 2022·Application pending·0 cites
- 0747US2023056222A1Semiconductor packagesSK HYNIX INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →