Inventor · disambiguated record
Katsuhiko Kitagawa
Also filed as: KITAGAWA KATSUHIKO
20 granted patents·2 pending applications·408 citations·filing 1989–2023
95Inventor score
Top patents by PatentIndex Score
22 records- 0194US7944015B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2008·Granted May 17, 2011·26 cites·3 claims
- 0293US7271466B2Semiconductor device with sidewall wiringSANYO ELECTRIC CO·Filed 2005·Granted Sep 18, 2007·25 cites·7 claims
- 0391US8102039B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jan 24, 2012·25 cites·8 claims
- 0491US6326701B1Chip size package and manufacturing method thereofSANYO ELECTRIC CO·Filed 2000·Granted Dec 4, 2001·74 cites·9 claims
- 0590US7312521B2Semiconductor device with holding memberSANYO ELECTRIC CO·Filed 2003·Granted Dec 25, 2007·49 cites·10 claims
- 0688US7919875B2Semiconductor device with recess portion over pad electrodeSANYO ELECTRIC CO·Filed 2007·Granted Apr 5, 2011·16 cites·4 claims
- 0786US6424051B1Semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted Jul 23, 2002·45 cites·19 claims
- 0885US5145073APallet for holding glass plates in standing postureCENTRAL GLASS CO LTD·Filed 1991·Granted Sep 8, 1992·78 cites·8 claims
- 0983US7633133B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Dec 15, 2009·12 cites·10 claims
- 1079US7986021B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Jul 26, 2011·9 cites·12 claims
- 1173US7312107B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Dec 25, 2007·17 cites·13 claims
- 1266US7589388B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2007·Granted Sep 15, 2009·3 cites·4 claims
- 1364US8686526B2Semiconductor device and method of manufacturing the sameKITAGAWA KATSUHIKO·Filed 2007·Granted Apr 1, 2014·4 cites·15 claims
- 1462US9034729B2Semiconductor device and method of manufacturing the sameYAMADA HIROSHI·Filed 2007·Granted May 19, 2015·1 cites·9 claims
- 1561US8148811B2Semiconductor device and manufacturing method thereofSHINOGI HIROYUKI·Filed 2007·Granted Apr 3, 2012·3 cites·7 claims
- 1661US8105856B2Method of manufacturing semiconductor device with wiring on side surface thereofNOMA TAKASHI·Filed 2004·Granted Jan 31, 2012·8 cites·3 claims
- 1759US8653612B2Semiconductor deviceOKADA KAZUO·Filed 2007·Granted Feb 18, 2014·1 cites·5 claims
- 1857US8766408B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jul 1, 2014·1 cites·11 claims
- 1955US4956001AMethod and apparatus for bending and annealing glass sheets to be laminatedCENTRAL GLASS CO LTD·Filed 1989·Granted Sep 11, 1990·11 cites·12 claims
- 2055US2023369179A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2147US8653529B2Semiconductor device and method of manufacturing the sameISHIBE SHINZO·Filed 2011·Granted Feb 18, 2014·0 cites·10 claims
- 2244US2008253009A1Front Surface MirrorCENTRAL GLASS CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →