Inventor · disambiguated record
Kazuyuki Kiuchi
Also filed as: KIUCHI KAZUYUKI
14 granted patents·29 pending applications·200 citations·filing 2001–2023
93Inventor score
Top patents by PatentIndex Score
43 records- 0191US7910206B2Self-rolling laminated sheet and self-rolling pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2007·Granted Mar 22, 2011·22 cites·9 claims
- 0289US6998175B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted Feb 14, 2006·42 cites·11 claims
- 0386US6488803B2Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the sameNITTO DENKO CORP·Filed 2001·Granted Dec 3, 2002·37 cites·6 claims
- 0484US8436481B2Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheetHOSHINO SHINJI·Filed 2010·Granted May 7, 2013·11 cites·6 claims
- 0582US7175728B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Feb 13, 2007·7 cites·4 claims
- 0681US7514143B2Re-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2004·Granted Apr 7, 2009·17 cites·13 claims
- 0780US8337656B2Pressure-sensitive adhesive sheet, method of processing adherend with the pressure-sensitive adhesive sheet, and apparatus for stripping pressure-sensitive adhesive sheetNISHIO AKINORI·Filed 2009·Granted Dec 25, 2012·8 cites·17 claims
- 0878US7718257B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2001·Granted May 18, 2010·14 cites·6 claims
- 0971US7163597B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jan 16, 2007·14 cites·4 claims
- 1067US2025346789A1PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE, AND METHOD FOR PRODUCING ß-1,3-GLUCAN DERIVATIVENITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 1167US2025320385A1PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, LAMINATE, AND METHOD FOR PRODUCING ß-1,3-GLUCAN DERIVATIVENITTO DENKO CORP·Filed 2023·Application pending·0 cites
- 1265US8502397B2Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheetYANAGI YUICHIRO·Filed 2010·Granted Aug 6, 2013·3 cites·6 claims
- 1363US7067030B2Heat-peelable adhesive sheetNITTO DENKO CORP·Filed 2003·Granted Jun 27, 2006·7 cites·6 claims
- 1461US7029550B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORORATION·Filed 2001·Granted Apr 18, 2006·8 cites·7 claims
- 1558US7214424B2Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2002·Granted May 8, 2007·6 cites·10 claims
- 1654US7147743B2Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the sameNITTO DENKO CORP·Filed 2001·Granted Dec 12, 2006·4 cites·7 claims
- 1753US2008216949A1Heat-Peelable Double-Faced Pressure-Sensitive Adhesive Sheet, Method Of Processing Adherend, and Electronic PartNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1853US2012270036A1Pressure-sensitive adhesive tape for electrochemical deviceKIUCHI KAZUYUKI·Filed 2011·Application pending·0 cites
- 1950US2007111392A1Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit boardNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2049US2008038540A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2148US2011195248A1Pressure-sensitive adhesive sheet with spontaneously rolling propertyNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2248US2011220268A1Surface protection tape for dicing and method for peeling and removing surface protection tape for dicingNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2347US2011117706A1Protective tape joining method and protective tape joining apparatusNISHIO AKINORI·Filed 2009·Application pending·0 cites
- 2447US2010243159A1Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 2545US2008085409A1Heat-resistant dicing tape or sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2645US2010028588A1Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherendNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2745US2008121335A1Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2844US2011200744A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 2944US2008011415A1Method for working object to be workedKIUCHI KAZUYUKI·Filed 2007·Application pending·0 cites
- 3042US2004191510A1Heat-peelable double-faced pressure-sensitive adhesive sheet, method of processing adherend, and electronic partNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 3142US2013273716A1Method of dicing substrateNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3242US2009288763A1Thermally strippable double faced adhesive sheet and method of working work pieceNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 3340US2004177918A1Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit boardFiled 2002·Application pending·0 cites
- 3440US2013220532A1Self-rolling adhesive filmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3540US2013224418A1Self-rolling adhesive filmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3639US2006257651A1Pressure-sensitive adhesive sheet for use in dicing and method of processing products worked with itSHINTANI TOSHIO·Filed 2006·Application pending·0 cites
- 3738US2012205030A1Spontaneously rolling adhesive sheet and method of manufacturing cut pieceKIUCHI KAZUYUKI·Filed 2012·Application pending·0 cites
- 3836US2010279491A1Die attach film-provided dicing tape and production process of semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 3936US2010252185A1Removable pressure sensitive adhesive sheet and method for processing adherend using the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 4035US2011237050A1Method for processing waferNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 4134US2011048641A1Method for separating and removing dicing surface protection tape from object to be cutNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 4233US2017335145A1Double-sided pressure-sensitive adhesive tapeNITTO DENKO MAT (MALAYSIA) SDN BHD·Filed 2017·Application pending·0 cites
- 4326US2013240141A1Heat-resistant pressure-sensitive adhesive tape for production of semiconductor device and method for producing semiconductor device using the tapeSOEJIMA KAZUKI·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Kazuyuki Kiuchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →