Inventor · disambiguated record
Katsuaki Kojima
Also filed as: KOJIMA KATSUAKI
5 granted patents·163 citations·filing 1989–2002
84Inventor score
Top patents by PatentIndex Score
5 records- 0191US6449836B1Method for interconnecting printed circuit boards and interconnection structureDENSO CORP·Filed 2000·Granted Sep 17, 2002·78 cites·29 claims
- 0280US6784375B2Interconnection structure for interconnecting printed circuit boardsDENSO CORP·Filed 2002·Granted Aug 31, 2004·23 cites·25 claims
- 0373US6605357B1Bonding method and bonding structure of thermoplastic resin materialDENSO CORP·Filed 2000·Granted Aug 12, 2003·12 cites·15 claims
- 0472US5039338AElectroless copper plating solution and process for formation of copper filmNIPPON DENSO CO·Filed 1989·Granted Aug 13, 1991·29 cites·13 claims
- 0559US5965211AElectroless copper plating solution and process for formation of copper filmNIPPON DENSO CO·Filed 1991·Granted Oct 12, 1999·21 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →