Inventor · disambiguated record
Katsuji Komatsu
Also filed as: KOMATSU KATSUJI
11 granted patents·532 citations·filing 1988–2002
93Inventor score
Top patents by PatentIndex Score
11 records- 0190US6396143B1Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted May 28, 2002·68 cites·3 claims
- 0290US4954308AResin encapsulating methodCITIZEN WATCH CO LTD·Filed 1988·Granted Sep 4, 1990·92 cites·6 claims
- 0388US6362436B1Printed wiring board for semiconductor plastic packageMITSUBISHI GAS CHEMICAL CO·Filed 2000·Granted Mar 26, 2002·49 cites·7 claims
- 0487US5108955AMethod of making a resin encapsulated pin grid array with integral heatsinkCITIZEN WATCH CO LTD·Filed 1991·Granted Apr 28, 1992·98 cites·4 claims
- 0582US6031292ASemiconductor device, interposer for semiconductor deviceHITACHI CABLE·Filed 1997·Granted Feb 29, 2000·66 cites·9 claims
- 0681US6479760B2Printed wiring board for semiconductor plastic packageMITSUBISHI GAS CHEMICAL CO·Filed 2001·Granted Nov 12, 2002·28 cites·7 claims
- 0771US5289039AResin encapsulated semiconductor deviceCITIZEN WATCH CO LTD·Filed 1992·Granted Feb 22, 1994·45 cites·5 claims
- 0867US5866948AInterposer for semiconductor deviceHITACHI CABLE·Filed 1996·Granted Feb 2, 1999·31 cites·4 claims
- 0966US7140103B2Process for the production of high-density printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2002·Granted Nov 28, 2006·13 cites·8 claims
- 1057US5179039AMethod of making a resin encapsulated pin grid array with integral heatsinkCITIZEN WATCH CO LTD·Filed 1991·Granted Jan 12, 1993·26 cites·2 claims
- 1147US5233225AResin encapsulated pin grid array and method of manufacturing the sameCITIZEN WATCH CO LTD·Filed 1991·Granted Aug 3, 1993·16 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →