Inventor · disambiguated record
Kazunori Kondo
Also filed as: KONDO KAZUNORI
51 granted patents·16 pending applications·122 citations·filing 1998–2025
97Inventor score
Files withSHINETSU CHEMICAL CO44SEMILEDS CORP6SUGO MICHIHIRO33M INNOVATIVE PROPERTIES CO2KONDO KAZUNORI2
Top patents by PatentIndex Score
67 records- 0196US11417799B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0296US10503067B2Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming processSHINETSU CHEMICAL CO·Filed 2018·Granted Dec 10, 2019·8 cites·12 claims
- 0388US7524394B2Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using sameSHINETSU CHEMICAL CO·Filed 2006·Granted Apr 28, 2009·7 cites·16 claims
- 0487US8796410B2Polymer having silphenylene and siloxane structures, a method of preparing the same, an adhesive composition, an adhesive sheet, a protective material for a semiconductor device, and a semiconductor deviceSUGO MICHIHIRO·Filed 2012·Granted Aug 5, 2014·10 cites·16 claims
- 0586US2024072203A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2023·Application pending·0 cites
- 0685US8226143B2Joint structure of door edge memberTAKEUCHI KATSUHIKO·Filed 2008·Granted Jul 24, 2012·19 cites·8 claims
- 0785US2024063339A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSAMILEDS CORP·Filed 2023·Application pending·0 cites
- 0883US8673537B2Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said compositionFURUYA MASAHIRO·Filed 2010·Granted Mar 18, 2014·4 cites·18 claims
- 0981US11862755B2Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·5 claims
- 1080USD1054388SCarrier substrate for handlingSHINETSU CHEMICAL CO·Filed 2022·Granted Dec 17, 2024·7 cites·1 claims
- 1180US11862754B2Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plateSEMILEDS CORP·Filed 2022·Granted Jan 2, 2024·0 cites·4 claims
- 1280US9447305B2Silicone resin, resin composition, resin film, semiconductor device, and making methodSHINETSU CHEMICAL CO·Filed 2015·Granted Sep 20, 2016·3 cites·11 claims
- 1380US8315780B2High pressure fuel pump control apparatus for internal combustion engineTOYOHARA MASAHIRO·Filed 2009·Granted Nov 20, 2012·11 cites·3 claims
- 1479US7524563B2Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using sameSHINETSU CHEMICAL CO·Filed 2006·Granted Apr 28, 2009·3 cites·22 claims
- 1577US10297485B2Semiconductor device, making method, and laminateSHINETSU CHEMICAL CO·Filed 2018·Granted May 21, 2019·2 cites·5 claims
- 1677US8466041B2Method for manufacturing lamination type semiconductor integrated deviceKURODA YASUYOSHI·Filed 2010·Granted Jun 18, 2013·6 cites·25 claims
- 1776US10319653B2Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the sameSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 11, 2019·3 cites·10 claims
- 1876US8501879B2Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatusKONDO KAZUNORI·Filed 2011·Granted Aug 6, 2013·5 cites·16 claims
- 1975US10308787B2Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2017·Granted Jun 4, 2019·2 cites·19 claims
- 2073US8596726B2Wheel for vehicleKONDO KAZUNORI·Filed 2011·Granted Dec 3, 2013·8 cites·3 claims
- 2173US7820740B2Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using sameSHINETSU CHEMICAL CO·Filed 2007·Granted Oct 26, 2010·1 cites·16 claims
- 2270USD1096678SStamp component for transferring microstructureSHINETSU CHEMICAL CO·Filed 2025·Granted Oct 7, 2025·0 cites·1 claims
- 2369US8808865B2Adhesive composition, and adhesive sheet, semiconductor apparatus-protective material and semiconductor apparatus using the sameSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 19, 2014·2 cites·16 claims
- 2467US10373903B2Laminate and making methodSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 6, 2019·0 cites·6 claims
- 2567US7820741B2Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using sameSHIN ETSU CHEMICALS CO LTD·Filed 2007·Granted Oct 26, 2010·1 cites·16 claims
- 2665US9472438B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Oct 18, 2016·1 cites·28 claims
- 2765US8408622B2Frame moldingYANAI TOSHIFUMI·Filed 2009·Granted Apr 2, 2013·5 cites·10 claims
- 2863US10377923B2Surface protective film, making method, and substrate processing laminateSHINETSU CHEMICAL CO·Filed 2017·Granted Aug 13, 2019·1 cites·10 claims
- 2960US10141272B2Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layerSHINETSU CHEMICAL CO·Filed 2015·Granted Nov 27, 2018·1 cites·7 claims
- 3059US6602929B1Liquid radiation-curable resin composition, optical fiber coating composition, and optical fiberSHINETSU CHEMICAL CO·Filed 2000·Granted Aug 5, 2003·4 cites·8 claims
- 3158US2017209932A1Sliding member and manufacturing method thereforTAIHO KOGYO CO LTD·Filed 2017·Application pending·0 cites
- 3257US2007087040A1Oil cleaning sheets for makeup3M INNOVATIVE PROPERTIES CO·Filed 2006·Application pending·0 cites
- 3355US2022320366A1Method To Remove An Isolation Layer On The Corner Between The Semiconductor Light Emitting Device To The Growth SubstrateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 3455US2024404865A1Receptor substrate, method for manufacturing receptor substrate, transfer method, method for manufacturing led panel, and stamperSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 3554US2006234045A1Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using sameSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 3653US2023018855A1Method For Fabricating (LED) Dice Using Laser Lift-Off From A Substrate To A Receiving PlateSEMILEDS CORP·Filed 2022·Application pending·0 cites
- 3752US10730273B2Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 3852US10514601B2Chemically amplified positive resist film laminate and pattern forming processSHINETSU CHEMICAL CO·Filed 2017·Granted Dec 24, 2019·0 cites·7 claims
- 3952US2006069200A1Acrylic adhesive composition and acrylic adhesive sheetSHINETSU CHEMICAL CO·Filed 2005·Application pending·0 cites
- 4051US11518876B2Photosensitive resin composition and photosensitive dry filmSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 6, 2022·0 cites·9 claims
- 4151US2023387084A1Method for producing a light emitting diode supply substrate, method for producing a light emitting diode display, method for producing a division unit for a light emitting diode display, and method for producing a device supply substrateSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 4250US10850482B2Resin composition, resin film, semiconductor laminate, method for manufacturing semiconductor laminate, and method for manufacturing semiconductor deviceSHINETSU CHEMICAL CO·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 4350US10796939B2Temporary adhesive film roll for substrate processing, method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 6, 2020·0 cites·21 claims
- 4449US10538630B2Silicone-modified polybenzoxazole resin and making methodSHINETSU CHEMICAL CO·Filed 2018·Granted Jan 21, 2020·0 cites·5 claims
- 4549US2012231289A1Sliding member and manufacturing method thereforKURONO TAKAHIRO·Filed 2010·Application pending·0 cites
- 4648US2006069201A1Acrylic flame retardant adhesive composition and acrylic flame retardant adhesive sheetSHINETSU CHEMICAL CO·Filed 2005·Application pending·0 cites
- 4746US2006264538A1Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using sameSHINETSU CHEMICAL CO·Filed 2006·Application pending·0 cites
- 4846US2022315418A1Method for transferring microstructures, and method for mounting microstructuresSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 4945US10719015B2Positive resist film laminate and pattern forming processSHINETSU CHEMICAL CO·Filed 2018·Granted Jul 21, 2020·0 cites·8 claims
- 5045US10428239B2Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2017·Granted Oct 1, 2019·0 cites·2 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →